Huawei technologies co., ltd. (20240222367). Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract
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Three-Dimensional Memory, Chip Package Structure, and Electronic Device
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Three-Dimensional Memory, Chip Package Structure, and Electronic Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222367 titled 'Three-Dimensional Memory, Chip Package Structure, and Electronic Device
The abstract of the patent application describes a three-dimensional memory structure that includes a substrate and a storage array layer. The storage array layer consists of multiple storage structures, each containing a series of capacitors stacked on the substrate in a direction away from it.
- The three-dimensional memory structure is designed to store data efficiently.
- The storage array layer includes multiple storage structures, each comprising n capacitors arranged side by side.
- Each capacitor within the storage structure consists of a first electrode, a first dielectric layer, and a second electrode stacked sequentially on the substrate.
- The capacitors are stacked in a direction away from the substrate, providing a compact and high-density memory storage solution.
- The technology allows for increased data storage capacity within a three-dimensional space.
Potential Applications: - High-capacity data storage devices - Memory modules for computers and servers - Embedded memory in electronic devices
Problems Solved: - Limited data storage capacity in traditional memory structures - Space constraints in memory devices - Need for efficient and compact data storage solutions
Benefits: - Increased data storage capacity - Compact and space-efficient memory design - Enhanced performance in data-intensive applications
Commercial Applications: Title: Three-Dimensional Memory Technology for High-Capacity Data Storage This technology can be utilized in various commercial applications such as: - Data centers - Consumer electronics - Automotive systems
Questions about Three-Dimensional Memory Technology: 1. How does the three-dimensional memory structure differ from traditional memory designs? The three-dimensional memory structure offers increased data storage capacity by stacking capacitors in a vertical direction, optimizing space utilization.
2. What are the potential challenges in implementing this technology in commercial products? Implementing this technology in commercial products may require overcoming manufacturing complexities and ensuring compatibility with existing memory systems.
Original Abstract Submitted
a three-dimensional memory includes a substrate and a storage array layer. the substrate is on a plane that extends in a first direction and a second direction. the storage array layer includes at least one storage structure, and the storage structure includes n capacitors disposed side by side on the substrate. each of the n capacitors includes a first electrode, a first dielectric layer, and a second electrode that are sequentially stacked on the substrate in a third direction away from the substrate, n≥2, and n is an integer. the three-dimensional memory is configured to store data.
