Huawei technologies co., ltd. (20240213203). CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract
Contents
CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE
Organization Name
Inventor(s)
Yonggang Zheng of Dongguan (CN)
CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240213203 titled 'CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE
The technology described in this patent application pertains to a chip package structure, a production method for a chip package structure, and an electronic device. The chip package structure includes multiple layers and structures that enable the direct transmission of signals from the die to the external environment.
- The chip package structure consists of a first connection layer with upper and lower surfaces, a die placed on the upper surface, a conduction structure on top of the die, a plastic package layer covering the die and conduction structure, and a rewiring layer on top of the plastic package layer.
- The conduction structure allows for the direct output of signals from the die through the rewiring layer, which is connected to the conduction structure.
- By exposing part of the conduction structure on the upper surface of the plastic package layer, the signal from the die can be efficiently led out without interference.
Potential Applications: - This technology can be used in various electronic devices that require efficient signal transmission from the internal components. - It can be particularly beneficial in high-speed communication devices where signal integrity is crucial.
Problems Solved: - Enables direct signal transmission from the die to the external environment. - Improves signal integrity and reduces interference in electronic devices.
Benefits: - Enhanced signal transmission efficiency. - Improved performance of electronic devices. - Simplified production process for chip package structures.
Commercial Applications: - This technology can be applied in the manufacturing of smartphones, tablets, computers, and other electronic devices that require high-speed signal transmission.
Questions about Chip Package Structure: 1. How does the rewiring layer facilitate the direct output of signals from the die? 2. What are the potential advantages of exposing part of the conduction structure on the upper surface of the plastic package layer?
Original Abstract Submitted
the technology of this application relates to a chip package structure, a production method for a chip package structure, and an electronic device. the chip package structure includes a first connection layer having an upper surface and a lower surface that are opposite to each other, a die disposed on the upper surface of the first connection layer, a first conduction structure disposed on an upper surface of the die, a first plastic package layer covering the die and the first conduction structure, and a rewiring layer disposed on the first plastic package layer. at least a part of the first conduction structure is exposed from an upper surface of the first plastic package layer. the rewiring layer is coupled to the first conduction structure. a signal of the die can be directly led out through the first conduction structure and the rewiring layer.
