Huawei technologies co., ltd. (20240206189). FERROELECTRIC MEMORY AND FORMING METHOD THEREOF, AND ELECTRONIC DEVICE simplified abstract

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FERROELECTRIC MEMORY AND FORMING METHOD THEREOF, AND ELECTRONIC DEVICE

Organization Name

huawei technologies co., ltd.

Inventor(s)

Wanliang Tan of Shenzhen (CN)

Yuxing Li of Shenzhen (CN)

Weigu Li of Shenzhen (CN)

Jialin Cai of Shenzhen (CN)

Hangbing Lv of Shenzhen (CN)

JEFFREY JUNHAO Xu of Shenzhen (CN)

FERROELECTRIC MEMORY AND FORMING METHOD THEREOF, AND ELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240206189 titled 'FERROELECTRIC MEMORY AND FORMING METHOD THEREOF, AND ELECTRONIC DEVICE

The abstract describes a ferroelectric memory with memory cells containing ferroelectric capacitors, each consisting of a first electrode, a second electrode, and a ferroelectric layer in between. Additionally, there are isolation passivation layers on either side of the ferroelectric layer to prevent oxygen diffusion to the electrodes.

  • Ferroelectric memory with memory cells and ferroelectric capacitors
  • Each capacitor has a first electrode, a second electrode, and a ferroelectric layer
  • Isolation passivation layers on either side of the ferroelectric layer prevent oxygen diffusion
  • Designed to improve the performance and reliability of the memory cells
  • Addresses issues related to oxygen diffusion in ferroelectric capacitors

Potential Applications: - Non-volatile memory storage - Embedded memory in integrated circuits - High-speed data processing applications

Problems Solved: - Oxygen diffusion in ferroelectric capacitors - Enhancing memory cell performance and reliability

Benefits: - Improved memory cell stability - Enhanced data retention capabilities - Higher efficiency in data processing applications

Commercial Applications: Title: Advanced Ferroelectric Memory Technology for High-Speed Data Processing This technology can be utilized in: - Consumer electronics - Automotive systems - Industrial automation

Questions about Ferroelectric Memory Technology: 1. How does the presence of isolation passivation layers impact the performance of ferroelectric memory cells?

  The isolation passivation layers prevent oxygen diffusion, improving the stability and reliability of the memory cells.

2. What are the key advantages of using ferroelectric memory in comparison to other types of memory technologies?

  Ferroelectric memory offers non-volatile storage, high-speed data processing, and enhanced data retention capabilities.


Original Abstract Submitted

a ferroelectric memory includes a substrate and a plurality of memory cells formed on the substrate. each memory cell includes a ferroelectric capacitor. the ferroelectric capacitor includes a first electrode and a second electrode, and a ferroelectric layer formed between the first electrode and the second electrode. the ferroelectric capacitor further includes a first isolation passivation layer formed between the first electrode and the ferroelectric layer, and a second isolation passivation layer formed between the second electrode and the ferroelectric layer. the first isolation passivation layer is configured to suppress diffusion of the oxygen element in the ferroelectric layer to the first electrode, and the second isolation passivation layer is configured to suppress diffusion of the oxygen element in the ferroelectric layer to the second electrode.