Huawei technologies co., ltd. (20240178167). CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE simplified abstract
Contents
- 1 CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE
Organization Name
Inventor(s)
CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178167 titled 'CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE
Simplified Explanation
The invention provides a chip package structure with a first chip connected to another chip through a first hybrid bonding structure. The first hybrid bonding structure includes a first bonding layer with a first insulation material and multiple first metal solder pads embedded in it, each with a groove structure.
- The chip package structure includes a first chip and a first hybrid bonding structure.
- The first hybrid bonding structure connects the first chip to another chip.
- The first bonding layer in the hybrid structure contains a first insulation material and multiple first metal solder pads.
- Each first metal solder pad has a groove structure buried in the insulation material.
- The groove opening of the structure is exposed on the surface of the insulation material.
Potential Applications
This technology could be used in semiconductor packaging, microelectronics, and integrated circuit manufacturing.
Problems Solved
This technology solves the problem of reliable and efficient bonding between chips in a package structure.
Benefits
The benefits of this technology include improved chip connectivity, enhanced performance, and increased reliability in electronic devices.
Potential Commercial Applications
Potential commercial applications of this technology include consumer electronics, automotive electronics, and industrial automation.
Possible Prior Art
One possible prior art for this technology could be the use of flip chip bonding in semiconductor packaging.
Unanswered Questions
1. How does this technology compare to traditional wire bonding methods in terms of performance and reliability? 2. Are there any limitations to the size or type of chips that can be connected using this hybrid bonding structure?
Original Abstract Submitted
the invention provide a chip package structure, which includes a first chip and a first hybrid bonding structure. the first chip is connected to another chip through the first hybrid bonding structure. the first hybrid bonding structure includes a first bonding layer. the first bonding layer is disposed on a side away from a substrate of the first chip, and the first bonding layer includes a first insulation material and a plurality of first metal solder pads embedded in the first insulation material. each of the plurality of first metal solder pads includes a groove structure. a groove bottom of the groove structure is buried in the first insulation material, and a groove opening of the groove structure is exposed to a surface of the first insulation material and is flush with the surface of the first insulation material.
