Huawei technologies co., ltd. (20240176217). DRIVE MOTOR, CAMERA MODULE, AND ELECTRONIC DEVICE simplified abstract
Contents
- 1 DRIVE MOTOR, CAMERA MODULE, AND ELECTRONIC DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DRIVE MOTOR, CAMERA MODULE, AND ELECTRONIC DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
DRIVE MOTOR, CAMERA MODULE, AND ELECTRONIC DEVICE
Organization Name
Inventor(s)
Zhangcheng Li of Shanghai (CN)
DRIVE MOTOR, CAMERA MODULE, AND ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240176217 titled 'DRIVE MOTOR, CAMERA MODULE, AND ELECTRONIC DEVICE
Simplified Explanation
The patent application describes a drive motor with a coil heat dissipation structure for efficient heat dissipation.
- Drive motor includes a carrier with a lens installation hole, a coil on the outer side of the carrier, and a coil heat dissipation structure between the carrier and the coil.
- The coil heat dissipation structure is fastened to the carrier and in thermal conduction with the coil for effective heat dissipation.
Potential Applications
The technology could be applied in various industries such as robotics, automotive, aerospace, and consumer electronics for improved motor performance and longevity.
Problems Solved
1. Overheating of drive motors leading to reduced efficiency and lifespan. 2. Inadequate heat dissipation causing performance issues in motor-driven systems.
Benefits
1. Enhanced heat dissipation capability. 2. Improved motor efficiency and reliability. 3. Extended motor lifespan.
Potential Commercial Applications
Optimizing drive motors in electric vehicles for better performance and longevity.
Possible Prior Art
There are existing patents related to heat dissipation structures for motors, but none specifically addressing the configuration described in this patent application.
Unanswered Questions
How does the coil heat dissipation structure impact the overall size of the drive motor?
The patent application does not provide information on whether the addition of the coil heat dissipation structure affects the size or form factor of the drive motor.
What materials are used in the coil heat dissipation structure for optimal heat dissipation?
The patent application does not specify the materials used in the coil heat dissipation structure or their thermal conductivity properties.
Original Abstract Submitted
in accordance with an embodiment, a drive motor includes a carrier comprising a lens installation hole configured to have an optical lens installed therein; a coil located on an outer side of the carrier; and a coil heat dissipation structure located between the carrier and the coil, wherein the coil heat dissipation structure is fastened to the carrier, and the coil is fastened to and is in thermal conduction with the coil heat dissipation structure.
