Huawei technologies co., ltd. (20240164052). HEAT DISSIPATION APPARATUS, DEVICE, RACK, AND SYSTEM simplified abstract
Contents
- 1 HEAT DISSIPATION APPARATUS, DEVICE, RACK, AND SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HEAT DISSIPATION APPARATUS, DEVICE, RACK, AND SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.9.1 Unanswered Questions
- 1.9.2 How does the heat dissipation apparatus compare to traditional cooling systems in terms of efficiency and performance?
- 1.9.3 What materials are used in the construction of the heat-conducting plate and mounting base, and how do they impact the overall effectiveness of the apparatus?
- 1.10 Original Abstract Submitted
HEAT DISSIPATION APPARATUS, DEVICE, RACK, AND SYSTEM
Organization Name
Inventor(s)
HEAT DISSIPATION APPARATUS, DEVICE, RACK, AND SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240164052 titled 'HEAT DISSIPATION APPARATUS, DEVICE, RACK, AND SYSTEM
Simplified Explanation
The heat dissipation apparatus described in the patent application includes a heat-conducting plate with a liquid channel on one surface, a mounting base with an accommodation cavity for the heat-conducting plate, and a pressing plate to fasten the heat-conducting plate in the cavity. A sealing cavity is formed between the pressing plate and the heat-conducting plate's surface, accommodating the liquid channel. Liquid inlet and outlet connectors are also present on the pressing plate.
- Heat-conducting plate with liquid channel
- Mounting base with accommodation cavity
- Pressing plate for fastening the heat-conducting plate
- Sealing cavity for accommodating the liquid channel
- Liquid inlet and outlet connectors on the pressing plate
Potential Applications
The heat dissipation apparatus can be used in various electronic devices such as computers, servers, and LED lights to efficiently dissipate heat generated during operation.
Problems Solved
This technology helps in effectively dissipating heat from electronic devices, preventing overheating and potential damage to the components.
Benefits
- Improved heat dissipation efficiency - Enhanced performance and longevity of electronic devices - Easy installation and maintenance of the apparatus
Potential Commercial Applications
The heat dissipation apparatus can be utilized in the manufacturing of electronic devices, cooling systems, and industrial machinery to ensure optimal performance and reliability.
Possible Prior Art
One possible prior art for this technology could be similar heat dissipation systems used in electronic devices and industrial equipment to manage heat generation and prevent overheating.
Unanswered Questions
How does the heat dissipation apparatus compare to traditional cooling systems in terms of efficiency and performance?
The article does not provide a direct comparison between the heat dissipation apparatus and traditional cooling systems in terms of efficiency and performance.
What materials are used in the construction of the heat-conducting plate and mounting base, and how do they impact the overall effectiveness of the apparatus?
The article does not mention the specific materials used in the construction of the heat-conducting plate and mounting base, nor does it discuss their impact on the effectiveness of the apparatus.
Original Abstract Submitted
a heat dissipation apparatus includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base. the first surface and the second surface are disposed opposite to each other. a pressing plate is configured to fasten the heat-conducting plate in the accommodation cavity. the pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel a liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.
