Huawei technologies co., ltd. (20240164040). ELECTRICAL LEAD-OUT STRUCTURE AND PREPARATION METHOD THEREOF, HERMETIC APPARATUS, AND OPTICAL COMMUNICATION DEVICE simplified abstract

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ELECTRICAL LEAD-OUT STRUCTURE AND PREPARATION METHOD THEREOF, HERMETIC APPARATUS, AND OPTICAL COMMUNICATION DEVICE

Organization Name

huawei technologies co., ltd.

Inventor(s)

Jun Luo of Wuhan (CN)

Zengguang Guo of Wuhan (CN)

Xiaokang Xiao of Dongguan (CN)

ELECTRICAL LEAD-OUT STRUCTURE AND PREPARATION METHOD THEREOF, HERMETIC APPARATUS, AND OPTICAL COMMUNICATION DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240164040 titled 'ELECTRICAL LEAD-OUT STRUCTURE AND PREPARATION METHOD THEREOF, HERMETIC APPARATUS, AND OPTICAL COMMUNICATION DEVICE

Simplified Explanation

The application describes an electrical lead-out structure for hermetic packaging, consisting of a flexible circuit board and a packaging layer. The flexible circuit board includes an electrical signal layer and a reinforcing layer with a window, while the packaging layer fills the window and insulates the electrical signal layer.

  • The electrical lead-out structure includes a flexible circuit board and a packaging layer.
  • The flexible circuit board has an electrical signal layer and a reinforcing layer with a window.
  • The packaging layer fills the window and insulates the electrical signal layer.
  • The structure forms a feed-through area for soldering to a hermetic housing.

Potential Applications

This technology can be applied in:

  • Hermetic packaging for electronic components
  • Optical communication devices
  • Medical devices requiring hermetic sealing

Problems Solved

This innovation addresses the following issues:

  • Ensuring hermetic sealing in electronic devices
  • Providing a reliable electrical lead-out structure
  • Simplifying the manufacturing process of hermetic packages

Benefits

The benefits of this technology include:

  • Improved reliability of hermetic sealing
  • Enhanced protection for electronic components
  • Simplified assembly process for hermetic packages

Potential Commercial Applications

This technology has potential commercial applications in:

  • Electronics manufacturing industry
  • Medical device manufacturing sector
  • Aerospace and defense industry

Possible Prior Art

One possible prior art for this technology could be traditional hermetic packaging methods using rigid circuit boards and sealing techniques.

Unanswered Questions

How does this technology compare to existing hermetic packaging solutions in terms of cost-effectiveness?

This article does not provide information on the cost implications of implementing this technology compared to traditional hermetic packaging methods. Further research or analysis would be needed to determine the cost-effectiveness of this innovation.

What impact does this technology have on the overall size and weight of the hermetic apparatus?

The article does not address how the use of this electrical lead-out structure may affect the size and weight of the hermetic apparatus. Additional testing or evaluation would be required to assess any changes in size and weight resulting from the implementation of this technology.


Original Abstract Submitted

this application provides an electrical lead-out structure and a preparation method thereof, a hermetic apparatus, and an optical communication device. the electrical lead-out structure is used for hermetic package. the electrical lead-out structure includes a flexible circuit board and a packaging layer. the flexible circuit board includes an electrical signal layer and a reinforcing layer that are stacked up, the reinforcing layer is provided with a window that passes through the reinforcing layer, the electrical signal layer is adjacent to the window, the packaging layer fills the window, and a side that is of the packaging layer and that faces the electrical signal layer is insulatingly adjacent to the electrical signal layer. the packaging layer is disposed on the flexible circuit board, so that in the electrical lead-out structure, a feed-through area used for soldering to a hermetic housing is formed.

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