Honor device co., ltd. (20240250016). Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract
Contents
- 1 Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Surface Treatment Technology
- 1.13 Original Abstract Submitted
Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device
Organization Name
Inventor(s)
Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240250016 titled 'Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device
Simplified Explanation
The patent application describes a method for treating the surface of a package substrate in electronic devices. The package substrate includes a dielectric material layer with resin and spherical SiO2 particles. A sacrificial layer covers the outer surface of the SiO2 particles, which is then treated to create a cavity around the particles. This allows a metal layer to enter the cavity and form a new anchor point between the SiO2 particles and the surrounding resin.
- Dielectric material layer with resin and spherical SiO2 particles
- Sacrificial layer covering the outer surface of the SiO2 particles
- Treatment of the sacrificial layer to create a cavity around the particles
- Formation of a new anchor point between the SiO2 particles and surrounding resin with a metal layer
Key Features and Innovation
- Surface treatment method for package substrates in electronic devices - Creation of a cavity around spherical SiO2 particles to form new anchor points - Improved adhesion between SiO2 particles and surrounding resin
Potential Applications
This technology can be applied in the manufacturing of electronic devices, such as integrated circuits, sensors, and other semiconductor components.
Problems Solved
- Enhances the adhesion between spherical SiO2 particles and surrounding resin - Improves the overall reliability and performance of electronic devices
Benefits
- Increased durability and stability of package substrates - Enhanced electrical properties of electronic components - Improved manufacturing processes for electronic devices
Commercial Applications
Potential commercial applications include the production of advanced electronic devices, semiconductor components, and integrated circuits. This technology can benefit industries such as telecommunications, consumer electronics, and automotive electronics.
Prior Art
Readers can explore prior research on surface treatment methods for package substrates in electronic devices, as well as studies on improving adhesion between different materials in semiconductor manufacturing.
Frequently Updated Research
Researchers may find updated studies on surface treatment techniques for enhancing the performance and reliability of electronic devices, as well as advancements in semiconductor manufacturing processes.
Questions about Surface Treatment Technology
What are the key benefits of improving adhesion between different materials in electronic devices?
Improving adhesion can enhance the reliability and durability of electronic components, leading to better overall performance and longevity of the devices.
How does the formation of new anchor points between particles and resin contribute to the stability of package substrates?
The new anchor points provide stronger connections between the materials, reducing the risk of delamination or detachment, thus increasing the stability and reliability of the package substrates.
Original Abstract Submitted
disclosed in this application are a surface treatment method, a package substrate, and an electronic device. the package substrate comprises a dielectric material layer. the dielectric material layer includes resin and spherical siofilled in the resin. an outer surface of at least part of the spherical siois covered with a sacrificial layer. the sacrificial layer covering the outer surface of the spherical siois treated, to reduce the volume of the sacrificial layer covering the outer surface of the spherical sio, so that a cavity is formed around the spherical sioor part of the spherical siois disengaged from the dielectric material layer. in this way, a metal layer may enter the cavity around the spherical sioand form a new anchor point between the spherical sioand surrounding resin.
