Honeywell international inc. (20240347386). BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS simplified abstract
Contents
BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS
Organization Name
Inventor(s)
James L. Tucker of Clearwater FL (US)
Eric E. Vogt of Independence MN (US)
James W, Karcz, Jr. of Plymouth MN (US)
BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347386 titled 'BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS
Simplified Explanation:
The patent application describes a semiconductor assembly consisting of two semiconductors with a mesh structure in between them. The lower surface of the second semiconductor is connected to the first semiconductor through electrical contacts on the upper surface. The mesh has openings that align with the electrical contacts.
- The semiconductor assembly includes a first semiconductor with electrical contacts, a second semiconductor adjacent to the first, and a mesh between them.
- The mesh has interconnecting struts and openings that match the electrical contacts on the first semiconductor.
- The lower surface of the second semiconductor is electrically connected to the first semiconductor via the electrical contacts.
Potential Applications: - This technology could be used in integrated circuits and electronic devices. - It may find applications in the manufacturing of sensors and communication devices.
Problems Solved: - Provides a reliable electrical connection between two semiconductors. - Enhances the structural integrity of the semiconductor assembly.
Benefits: - Improved electrical connectivity. - Enhanced mechanical stability. - Potential for miniaturization in electronic devices.
Commercial Applications: Title: Semiconductor Assembly for Enhanced Electrical Connectivity This technology could be utilized in the production of smartphones, tablets, and other consumer electronics. It may also have applications in the automotive industry for sensors and control systems.
Prior Art: Prior research in semiconductor packaging and interconnection technologies may provide insights into similar approaches to enhancing electrical connectivity in semiconductor assemblies.
Frequently Updated Research: Ongoing research in semiconductor materials and packaging techniques may lead to advancements in the field of semiconductor assembly design and performance.
Questions about Semiconductor Assembly Technology: 1. How does the mesh structure improve the electrical connectivity between the two semiconductors? 2. What are the potential challenges in scaling this technology for mass production?
Original Abstract Submitted
a semiconductor assembly including: a first semiconductor having a plurality of electrical contacts extending from an upper surface of the first semiconductor; a second semiconductor adjacent to the first semiconductor; and a mesh disposed between and affixed to the upper surface of the first semiconductor and the lower surface of the second semiconductor. a lower surface of the second semiconductor is electrically connected to the first semiconductor via the plurality of electrical contacts. the mesh comprises a plurality of interconnecting struts defining a plurality of openings, wherein the plurality of openings is configured to receive the plurality of electrical contacts.
