Google llc (20250008845). LOW FOOTPRINT RESONATOR IN FLIP CHIP GEOMETRY
Contents
LOW FOOTPRINT RESONATOR IN FLIP CHIP GEOMETRY
Organization Name
Inventor(s)
Julian Shaw Kelly of Santa Barbara CA US
Evan Jeffrey of Santa Barbara CA US
LOW FOOTPRINT RESONATOR IN FLIP CHIP GEOMETRY
This abstract first appeared for US patent application 20250008845 titled 'LOW FOOTPRINT RESONATOR IN FLIP CHIP GEOMETRY
Original Abstract Submitted
a device includes a first substrate having a principal surface; a second substrate having a principal surface, in which the first substrate is bump-bonded to the second substrate such that the principal surface of the first substrate faces the principal surface of the second substrate; a circuit element having a microwave frequency resonance mode, in which a first portion of the circuit element is arranged on the principal surface of the first substrate and a second portion of the circuit element is arranged on the principal surface of the second substrate; and a first bump bond connected to the first portion of the circuit element and to the second portion of the circuit element, in which the first superconductor bump bond provides an electrical connection between the first portion and the second portion.
