Google llc (20240194661). MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION simplified abstract
Contents
- 1 MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Commercial Applications
- 1.9 Prior Art
- 1.10 Frequently Updated Research
- 1.11 Questions about the Technology
- 1.12 Original Abstract Submitted
MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION
Organization Name
Inventor(s)
Zhimin Jamie Yao of Santa Barbara CA (US)
Michael C. Hamilton of Auburn AL (US)
Marissa Giustina of Santa Barbara CA (US)
Brian James Burkett of Santa Barbara CA (US)
Theodore Charles White of Santa Barbara CA (US)
Ofer Naaman of Santa Barbara CA (US)
MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194661 titled 'MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION
Simplified Explanation
The patent application describes a method involving a first chip with multiple circuit elements distributed across different layers. A sacrificial material fills the space between these circuit elements, and a coherent device layer is placed on top. The method involves removing the sacrificial material.
- The method involves providing a chip with a complex circuit element layer stack.
- The circuit element layer stack includes multiple circuit elements spread across different layers.
- A sacrificial material fills the space between these circuit elements.
- A coherent device layer is placed on top of the circuit element layer stack.
- The method includes removing the sacrificial material.
Potential Applications
This technology could be used in the semiconductor industry for advanced chip manufacturing processes. It may also have applications in the development of high-performance electronic devices.
Problems Solved
This technology addresses the challenge of integrating multiple circuit elements in a compact space without interference. By using sacrificial material, the method allows for the creation of complex circuit element layer stacks.
Benefits
The method offers a solution for creating intricate circuit designs in a more efficient and effective manner. It enables the development of advanced electronic devices with improved performance.
Commercial Applications
- Semiconductor manufacturing processes
- High-performance electronic devices
- Advanced chip design and development
Prior Art
Readers can explore prior art related to this technology by researching semiconductor manufacturing methods, advanced chip design techniques, and sacrificial material applications in electronics.
Frequently Updated Research
Stay informed about the latest advancements in semiconductor manufacturing, chip design, and electronic device development to understand the evolving landscape of this technology.
Questions about the Technology
What are the potential implications of this technology in the semiconductor industry?
This technology could revolutionize chip manufacturing processes by enabling the creation of more complex and efficient electronic devices.
How does the use of sacrificial material contribute to the development of advanced circuit designs?
The sacrificial material plays a crucial role in creating intricate circuit element layer stacks by filling the space between circuit elements and allowing for the placement of a coherent device layer.
Original Abstract Submitted
a method includes providing a first chip having a circuit element layer stack, the circuit element layer stack including a plurality of circuit elements distributed across a plurality of layers. the circuit element layer stack has a sacrificial material filling a space between the plurality of circuit elements in the plurality of layers and a coherent device layer disposed on the circuit element layer stack. the method includes removing the sacrificial material.
