Google llc (20240194532). MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION simplified abstract

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

Organization Name

google llc

Inventor(s)

Zhimin Jamie Yao of Santa Barbara CA (US)

Michael C. Hamilton of Auburn AL (US)

Marissa Giustina of Santa Barbara CA (US)

Brian James Burkett of Santa Barbara CA (US)

Theodore Charles White of Santa Barbara CA (US)

Ofer Naaman of Santa Barbara CA (US)

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240194532 titled 'MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

Simplified Explanation

The method involves removing sacrificial material from a chip with circuit elements distributed across multiple layers.

• The method involves providing a chip with a circuit element layer stack.
• The circuit element layer stack includes multiple circuit elements spread across different layers.
• A sacrificial material fills the space between the circuit elements in the layers.
• A coherent device layer is placed on top of the circuit element layer stack.
• The method includes removing the sacrificial material.

Key Features and Innovation

• Utilizes sacrificial material to fill the space between circuit elements in a chip.
• Allows for the removal of sacrificial material to create a coherent device layer.
• Enables the creation of complex circuit structures with multiple layers.

Potential Applications

This technology can be applied in the semiconductor industry for the fabrication of advanced integrated circuits and electronic devices.

Problems Solved

This method addresses the challenge of integrating circuit elements across multiple layers in a chip while maintaining structural integrity.

Benefits

• Facilitates the creation of complex circuit structures.
• Enhances the performance and functionality of integrated circuits.
• Enables the development of more advanced electronic devices.

Commercial Applications

• Semiconductor manufacturing industry for producing advanced integrated circuits.
• Electronics industry for creating high-performance electronic devices.

Prior Art

Readers can explore prior art related to this technology in the field of semiconductor fabrication processes and integrated circuit design.

Frequently Updated Research

Stay updated on the latest advancements in semiconductor fabrication processes and integrated circuit design to enhance the application of this technology.

Questions about the Technology

What are the potential challenges in removing sacrificial material from the chip?

Removing sacrificial material from the chip may require precise techniques to avoid damaging the circuit elements.

How does the presence of sacrificial material impact the performance of the circuit elements?

The sacrificial material may affect the electrical properties of the circuit elements and need to be carefully removed to ensure optimal performance.

Original Abstract Submitted

a method includes providing a first chip having a circuit element layer stack, the circuit element layer stack including a plurality of circuit elements distributed across a plurality of layers. the circuit element layer stack has a sacrificial material filling a space between the plurality of circuit elements in the plurality of layers and a coherent device layer disposed on the circuit element layer stack. the method includes removing the sacrificial material.