Google llc (20240186214). Three Dimensional IC Package with Thermal Enhancement simplified abstract
Contents
- 1 Three Dimensional IC Package with Thermal Enhancement
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Three Dimensional IC Package with Thermal Enhancement - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Frequently Updated Research
- 1.12 Original Abstract Submitted
Three Dimensional IC Package with Thermal Enhancement
Organization Name
Inventor(s)
Woon-Seong Kwon of Santa Clara CA (US)
Madhusudan K. Iyengar of Foster City CA (US)
Teckgyu Kang of Saratoga CA (US)
Three Dimensional IC Package with Thermal Enhancement - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186214 titled 'Three Dimensional IC Package with Thermal Enhancement
Simplified Explanation
The patent application describes an IC die with a temperature control element for enhanced thermal management.
- The temperature control element is integrated into the IC die to assist in controlling the temperature during operation.
- It includes a heat dissipation material to help dissipate thermal energy generated by the devices in the IC die.
- The design is suitable for three-dimensional IC packages, providing improved thermal control and management.
Potential Applications
The technology can be applied in various electronic devices such as smartphones, computers, and servers to improve thermal performance and reliability.
Problems Solved
1. Overheating issues in IC dies during operation. 2. Inadequate thermal control in three-dimensional IC packages.
Benefits
1. Enhanced thermal management. 2. Improved reliability and performance of electronic devices. 3. Extended lifespan of IC dies.
Potential Commercial Applications
Optimizing thermal control in electronic devices for better performance and longevity.
Possible Prior Art
There may be existing patents or publications related to thermal management solutions for IC dies, but specific prior art is not provided in the abstract.
Unanswered Questions
How does the temperature control element impact the overall size of the IC die?
The size of the IC die may be affected by the integration of the temperature control element, potentially impacting the overall design and layout of the device.
What materials are commonly used for heat dissipation in IC dies?
Different heat dissipation materials may be utilized in IC dies for effective thermal management, but specific details are not mentioned in the abstract.
Frequently Updated Research
There may be ongoing research in the field of thermal management for IC dies, focusing on innovative solutions for improved performance and efficiency.
Original Abstract Submitted
an ic die includes a temperature control element suitable for three-dimensional ic package with enhanced thermal control and management. the temperature control element may be formed as an integral part of an ic die that may assist temperature control of the ic die when in operation. the temperature control element may include a heat dissipation material disposed therein to assist dissipating thermal energy generated by the plurality of devices in the ic die during operation.
