Google llc (20240186143). FABRICATING A DEVICE USING A MULTILAYER STACK simplified abstract
Contents
- 1 FABRICATING A DEVICE USING A MULTILAYER STACK
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FABRICATING A DEVICE USING A MULTILAYER STACK - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
FABRICATING A DEVICE USING A MULTILAYER STACK
Organization Name
Inventor(s)
Anthony Edward Megrant of Goleta CA (US)
FABRICATING A DEVICE USING A MULTILAYER STACK - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186143 titled 'FABRICATING A DEVICE USING A MULTILAYER STACK
Simplified Explanation
The method described in the abstract involves fabricating a device by forming a multilayer stack on a substrate, patterning the stack to create openings, and then dry etching the substrate.
- Form a multilayer stack on a substrate with a supporting layer and a photoresist layer.
- Pattern the multilayer stack to create openings, undercutting the photoresist layer.
- Anisotropically dry etch the substrate to further define the device structure.
Potential Applications
This technology could be applied in the semiconductor industry for the fabrication of microelectronic devices, sensors, and integrated circuits.
Problems Solved
This method solves the problem of accurately defining and etching intricate patterns on substrates, enabling the production of high-quality devices with precise features.
Benefits
The benefits of this technology include improved device performance, increased manufacturing efficiency, and the ability to create complex structures with high resolution.
Potential Commercial Applications
Potential commercial applications of this technology include the production of advanced electronic devices, MEMS devices, and photonic devices.
Possible Prior Art
One possible prior art for this technology could be the use of similar multilayer stack fabrication methods in the semiconductor industry.
What are the environmental implications of using this technology?
Using this technology in the semiconductor industry may have environmental implications due to the chemicals and energy required for the fabrication process. Implementing sustainable practices and materials could help mitigate these effects.
How does this technology compare to existing fabrication methods in terms of cost and efficiency?
Compared to traditional fabrication methods, this technology may offer improved cost-effectiveness and efficiency in creating intricate device structures. Further research and development could provide more insights into the comparative advantages of this method.
Original Abstract Submitted
a method of fabricating a device is presented. the method includes forming a multilayer stack on a substrate which has a principal surface. the multilayer stack includes a supporting layer formed over the principal surface of the substrate and a photoresist layer formed on the supporting layer, patterning the multilayer stack to form at least one opening such that the photoresist layer is undercut by the supporting layer and anisotropically dry etching the substrate.
