Google llc (20240162179). PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION simplified abstract
Contents
- 1 PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
Organization Name
Inventor(s)
Erik Anthony Lucero of Goleta CA (US)
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162179 titled 'PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
Simplified Explanation
The patent application describes a stacked device with a quantum information processing device on a first substrate, bonded to a second substrate with bump bonds and pillars providing electrical connections and defining a separation distance.
- The device includes a first substrate with a quantum information processing device.
- A second substrate is bonded to the first substrate.
- Multiple bump bonds provide electrical connections between the substrates.
- At least one pillar between the substrates defines a separation distance.
- Each pillar has a greater cross-sectional area than each bump bond.
Potential Applications
This technology could be applied in:
- Quantum computing
- Semiconductor manufacturing
- Advanced electronics
Problems Solved
This technology addresses issues such as:
- Ensuring proper electrical connections in stacked devices
- Maintaining precise separation distances between substrates
Benefits
The benefits of this technology include:
- Improved performance of quantum information processing devices
- Enhanced reliability of stacked devices
- Increased efficiency in semiconductor manufacturing processes
Potential Commercial Applications
This technology has potential in various commercial applications, including:
- Quantum computing systems
- High-performance computing devices
- Advanced sensors and detectors
Possible Prior Art
One possible prior art for this technology could be the use of bump bonds and pillars in semiconductor packaging to provide electrical connections and mechanical support between stacked substrates.
Unanswered Questions
How does this technology impact the scalability of quantum computing systems?
This article does not delve into the scalability aspect of quantum computing systems and how this technology may affect it.
What are the environmental implications of using bump bonds and pillars in electronic devices?
The environmental impact of manufacturing and disposing of devices with bump bonds and pillars is not discussed in this article.
Original Abstract Submitted
a stacked device including a first substrate that includes a quantum information processing device, a second substrate bonded to the first substrate, and multiple bump bonds and at least one pillar between the first substrate and the second substrate. each bump bond of the multiple bump bonds provides an electrical connection between the first substrate and the second substrate. at least one pillar defines a separation distance between a first surface of the first substrate and a first surface of the second substrate. a cross-sectional area of each pillar is greater than a cross-sectional area of each bump bond of the multiple bump bonds, where the cross-sectional area of each pillar and of each bump bond is defined along a plane parallel to the first surface of the first substrate or to the first surface of the second substrate.
