Google llc (20240162050). SIGNAL DISTRIBUTION FOR A QUANTUM COMPUTING SYSTEM simplified abstract
Contents
- 1 SIGNAL DISTRIBUTION FOR A QUANTUM COMPUTING SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SIGNAL DISTRIBUTION FOR A QUANTUM COMPUTING SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SIGNAL DISTRIBUTION FOR A QUANTUM COMPUTING SYSTEM
Organization Name
Inventor(s)
Evan Jeffrey of Santa Barbara CA (US)
Joshua Yousouf Mutus of Santa Barbara CA (US)
SIGNAL DISTRIBUTION FOR A QUANTUM COMPUTING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162050 titled 'SIGNAL DISTRIBUTION FOR A QUANTUM COMPUTING SYSTEM
Simplified Explanation
The abstract describes a method of fabricating a carrier chip for distributing signals among circuit elements of a quantum computing device. The process involves providing a multilayer wiring stack, bonding a capping layer with a single crystal silicon dielectric layer, forming a via hole, creating an electrically conductive via, and forming a circuit element directly electrically coupled to the via.
- Providing a multilayer wiring stack with alternating layers of dielectric material and wiring
- Bonding a capping layer with a single crystal silicon dielectric layer
- Forming a via hole within the capping layer that extends to a first wiring layer
- Creating an electrically conductive via within the via hole, connected to the first wiring layer
- Forming a circuit element on the capping layer surface, directly electrically coupled to the via
Potential Applications
This technology can be applied in quantum computing devices to efficiently distribute signals among circuit elements.
Problems Solved
This method solves the problem of effectively distributing signals among circuit elements in a quantum computing device.
Benefits
The direct electrical coupling provided by this method ensures efficient signal distribution and enhances the overall performance of the quantum computing device.
Potential Commercial Applications
This technology can be utilized in the development of advanced quantum computing devices for various industries, including research institutions and technology companies.
Possible Prior Art
Prior art in the field of quantum computing may include methods of signal distribution among circuit elements, but the specific approach described in this patent application may be novel.
Unanswered Questions
How does this method compare to traditional signal distribution techniques in quantum computing devices?
This article does not provide a direct comparison between this method and traditional signal distribution techniques in quantum computing devices. Further research or experimentation may be needed to determine the advantages and limitations of this approach.
What are the potential challenges or limitations of implementing this fabrication process on a larger scale?
The article does not address the scalability of this fabrication process for mass production. It is essential to investigate the feasibility and potential obstacles of scaling up this method for commercial applications.
Original Abstract Submitted
a method of fabricating a carrier chip for distributing signals among circuit elements of a quantum computing device, includes: providing a multilayer wiring stack, the multilayer wiring stack comprising alternating layers of dielectric material and wiring; bonding a capping layer to the multilayer wiring stack, in which the capping layer includes a single crystal silicon dielectric layer; forming a via hole within the capping layer, in which the via hole extends to a first wiring layer of the multilayer wiring stack; forming an electrically conductive via within the via hole and electrically coupled to the first wiring layer; and forming a circuit element on a surface of the capping layer, in which the circuit element is directly electrically coupled to the electrically conductive via.
