Google llc (20240121931). Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies simplified abstract

Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies

Organization Name

google llc

Inventor(s)

Yingshi Tang of Danville CA (US)

Yingying Wang of Sunnyvale CA (US)

Padam Jain of San Jose CA (US)

Emad Samadiani of Cypress CA (US)

Sudharshan Sugavanesh Udhayakumar of San Jose CA (US)

Madhusudan K. Iyengar of Foster City CA (US)

Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240121931 titled 'Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit Dies

Simplified Explanation

The abstract of the patent application describes methods and structures for providing thermal dissipating elements on integrated circuit (IC) dies. A thermal dissipating element placement assembly, such as a pin fin placement assembly, along with a vacuum pickup assembly, can be used to assist with simultaneous placement of multiple pin fins with desired profiles on desired locations of the IC die. The pin fin placement assembly may be comprised of one or more plates with a plurality of apertures for receiving the pin fins. The pin fin placement assembly can be further incorporated into a thermal cooling structure, which can include a manifold configured to encase the IC die and attached pin fins.

• Thermal dissipating element placement assembly for IC dies
• Pin fin placement assembly with vacuum pickup assembly for simultaneous placement of multiple pin fins
• Plates with apertures for receiving pin fins
• Incorporation into a thermal cooling structure with a manifold

Potential Applications

The technology can be applied in various electronic devices such as computers, smartphones, and servers to improve thermal management and prevent overheating of integrated circuits.

Problems Solved

1. Overheating of integrated circuits 2. Inefficient thermal dissipation in electronic devices

Benefits

1. Improved thermal management 2. Enhanced performance and reliability of electronic devices 3. Prevention of overheating-related damage

Potential Commercial Applications

1. Consumer electronics 2. Data centers 3. Automotive electronics

Possible Prior Art

Prior art in the field of thermal management for integrated circuits includes various methods and structures for dissipating heat, such as heat sinks and fans.

Unanswered Questions

How does the pin fin placement assembly compare to traditional heat sink designs in terms of efficiency and cost-effectiveness?

The article does not provide a direct comparison between the pin fin placement assembly and traditional heat sink designs in terms of efficiency and cost-effectiveness.

Are there any limitations or challenges associated with the implementation of the thermal cooling structure in different electronic devices?

The article does not address any potential limitations or challenges that may arise when implementing the thermal cooling structure in various electronic devices.

Original Abstract Submitted

methods and structures for providing thermal dissipating elements on integrated circuit (“ic”) dies are disclosed. a thermal dissipating element placement assembly, such as a pin fin placement assembly, along with a vacuum pickup assembly, can be used to assist with simultaneous placement of multiple pin fins with desired profiles on desired locations of the ic die. the pin fin placement assembly may be comprised of one or more plates with a plurality of apertures therein for receiving the pin fins. the pin fin placement assembly can be further incorporated into a thermal cooling structure, which can include a manifold configured to encase the ic die and attached pin fins.