Gm global technology operations llc (20240234859). HOLLOW COPPER THERMAL CONDUCTORS simplified abstract

HOLLOW COPPER THERMAL CONDUCTORS

Organization Name

gm global technology operations llc

Inventor(s)

Andrew Clay Bobel of Troy MI (US)

Anil K. Sachdev of Rochester Hills MI (US)

Anthony Michael Coppola of Rochester Hills MI (US)

Sayed Youssef Sayed Nagy of Troy MI (US)

Jian Yao of Shanghai (CN)

HOLLOW COPPER THERMAL CONDUCTORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240234859 titled 'HOLLOW COPPER THERMAL CONDUCTORS

The process described in the patent application involves creating a ribbon-shaped hollow thermal conductor by first forming a sacrificial material into an insert with multiple parallel strands. This insert is then plated with copper to form the ribbon-shaped structure. Finally, the sacrificial material is removed from within the ribbon-shaped structure, leaving behind a hollow passage through the copper thermal conductor.

• Form sacrificial material into an insert with parallel strands
• Plate the sacrificial insert with copper to create a ribbon-shaped structure
• Remove sacrificial material to create a hollow passage through the copper thermal conductor

Potential Applications: - Heat dissipation in electronic devices - Thermal management in aerospace applications - Cooling systems in automotive industry

Problems Solved: - Efficient heat transfer - Improved thermal conductivity - Space-saving design for thermal management systems

Benefits: - Enhanced cooling performance - Reduced size and weight of thermal conductors - Increased efficiency in heat dissipation

Commercial Applications: Title: "Innovative Hollow Thermal Conductor for Enhanced Heat Dissipation" This technology can be utilized in various industries such as electronics, aerospace, and automotive for improved thermal management and heat dissipation. The market implications include increased efficiency, reduced energy consumption, and enhanced product performance.

Questions about the technology: 1. How does the hollow design of the thermal conductor improve heat dissipation compared to solid conductors? 2. What are the potential cost savings associated with using this innovative thermal conductor design?

Frequently Updated Research: Stay updated on the latest advancements in thermal management technologies and materials to enhance the performance and efficiency of hollow thermal conductors. Explore new plating techniques, sacrificial materials, and design improvements for optimal heat dissipation.

Original Abstract Submitted

a process for making a ribbon-shaped hollow thermal conductor includes forming a sacrificial material into an insert including a plurality of parallel strands. plating the sacrificial insert with copper to form a ribbon-shaped structure and removing the sacrificial material from within the ribbon-shaped structure to create a hollow passage through a ribbon-shaped hollow copper thermal conductor.