Gm global technology operations llc (20240234239). COOLED POWER MODULE simplified abstract

COOLED POWER MODULE

Organization Name

gm global technology operations llc

Inventor(s)

Muhammad Hussain Alvi of Troy MI (US)

Junghoon Kim of ANN ARBOR MI (US)

Yilun Luo of Ann Arbor MI (US)

Kevin David Corpetti-vazquez of Davisburg MI (US)

COOLED POWER MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240234239 titled 'COOLED POWER MODULE

Simplified Explanation

The patent application describes a 1.5 sided cooled power module for improved cooling and gate connections. It involves a structure with two direct bond copper (DBC) layers and dielectric layers, with semiconductor dies placed in between. Bond wires are used to connect the dies to the DBC layers.

• The patent application focuses on a 1.5 sided cooled power module design.
• It includes upside and downside direct bond copper (DBC) layers with dielectric layers in between.
• Semiconductor dies are positioned between the DBC layers.
• Bond wires are used to connect the dies to the DBC layers.
• The design allows for enhanced cooling and gate connections.

Key Features and Innovation

• 1.5 sided cooled power module design
• Direct bond copper (DBC) layers with dielectric layers
• Semiconductor dies placed between the DBC layers
• Bond wires for connecting dies to DBC layers
• Enhanced cooling and gate connections

Potential Applications

The technology can be applied in various power module systems that require efficient cooling and reliable gate connections, such as in electric vehicles, renewable energy systems, and industrial machinery.

Problems Solved

The technology addresses the challenges of heat dissipation and reliable electrical connections in power module systems, ensuring optimal performance and longevity.

Benefits

• Improved cooling efficiency
• Enhanced gate connections
• Increased reliability and performance
• Extended lifespan of power module systems

Commercial Applications

Title: Enhanced Cooling Power Modules for Electric Vehicles and Renewable Energy Systems This technology can be utilized in electric vehicles, renewable energy systems, and industrial machinery to improve cooling efficiency and ensure reliable gate connections. It has the potential to enhance the performance and longevity of power module systems in various commercial applications.

Questions about the Technology

Question 1

How does the 1.5 sided cooled power module design improve cooling efficiency compared to traditional power modules? The 1.5 sided cooled power module design allows for enhanced heat dissipation due to the direct bond copper (DBC) layers and dielectric layers, ensuring efficient cooling of the semiconductor dies.

Question 2

What are the potential cost implications of implementing this technology in power module systems? Implementing this technology may initially involve higher manufacturing costs due to the use of direct bond copper (DBC) layers and specialized bonding techniques. However, the long-term benefits of improved performance and reliability may outweigh the initial costs.

Original Abstract Submitted

aspects of the disclosure include a 1.5 sided cooled power module for enhanced cooling and gate connections. an exemplary cooled power module can include an upside direct bond copper (dbc) having a first top copper layer, a first bottom copper layer, and a first dielectric layer between the first top copper layer and the first bottom copper layer. a downside dbc includes a second top copper layer, a second bottom copper layer, and a second dielectric layer between the second top copper layer and the second bottom copper layer. one or more dies are positioned between the upside dbc and the downside dbc. the upside dbc is sized such that a portion of an uppermost surface of the one or more dies remains exposed. bond wires are placed on the exposed portion of the one or more dies and terminated on the first top copper layer of the upside dbc.