Fujifilm corporation (20240321482). CONDUCTIVE FILM simplified abstract
Contents
CONDUCTIVE FILM
Organization Name
Inventor(s)
Hideki Tomizawa of Kanagawa (JP)
Kazuhiro Hasegawa of Kanagawa (JP)
Takahiro Ohno of Kanagawa (JP)
CONDUCTIVE FILM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321482 titled 'CONDUCTIVE FILM
The patent application describes a conductive film with excellent adhesiveness of a conductive thin wire after a durability test.
- Transparent substrate
- Mesh pattern made of a conductive thin wire
- Conductive thin wire includes a black layer with carbon black, a palladium-containing layer, and a metal plating layer
- Layers are arranged in order from the transparent substrate side
Potential Applications: - Touchscreen displays - Flexible electronics - Printed circuit boards
Problems Solved: - Improving adhesiveness of conductive thin wires - Enhancing durability of conductive films
Benefits: - Increased longevity of electronic devices - Improved performance of touchscreens - Enhanced reliability of printed circuit boards
Commercial Applications: Title: Enhanced Conductive Film for Electronics This technology can be used in the manufacturing of touchscreen devices, flexible electronics, and printed circuit boards, leading to more durable and reliable products in the market.
Questions about Conductive Film: 1. How does the inclusion of a black layer with carbon black improve the performance of the conductive thin wire?
- The black layer with carbon black helps enhance conductivity and adhesion of the thin wire.
2. What are the potential market implications of this innovative conductive film technology?
- The technology can lead to the production of more reliable and durable electronic devices, increasing consumer trust and market competitiveness.
Original Abstract Submitted
a conductive film having excellent adhesiveness of a conductive thin wire after a durability test film includes: a transparent substrate; and a mesh pattern that is disposed on the transparent substrate and is formed of a conductive thin wire, in which the conductive thin wire includes a black layer including carbon black, a palladium-containing layer, and a metal plating layer in order from the transparent substrate side.
