Denso corporation (20240258264). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
Contents
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
Takanori Kawashima of Kariya-city (JP)
Shinji Hiramitsu of Kariya-city (JP)
Tomomi Okumura of Kariya-city (JP)
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258264 titled 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
The semiconductor device described in the abstract includes a semiconductor element, wiring members connected to main electrodes on different surfaces of the semiconductor element, and a signal terminal connected to a signal pad through a bonding wire.
- The second wiring member consists of an insulating base material, a front surface metal body adjacent to the semiconductor element, and a back surface metal body.
- The front surface metal body is positioned between the bonding target and the semiconductor element in the arrangement direction of the semiconductor element and the signal terminal.
Potential Applications: - This technology can be used in various semiconductor devices for improved electrical connections. - It can be applied in integrated circuits, sensors, and other electronic devices.
Problems Solved: - Enhances the reliability and efficiency of electrical connections in semiconductor devices. - Provides a compact and effective solution for wiring in semiconductor elements.
Benefits: - Improved performance and durability of semiconductor devices. - Simplified manufacturing processes for electronic components.
Commercial Applications: Title: Advanced Semiconductor Wiring Technology for Enhanced Device Performance This technology can be utilized in the semiconductor industry for the production of high-quality and reliable electronic components. It can lead to the development of more efficient and durable devices, attracting interest from manufacturers and researchers.
Prior Art: Readers can explore prior research on semiconductor wiring techniques, materials, and designs to understand the evolution of this technology.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor wiring technology, materials science, and electronic device manufacturing to enhance your knowledge in this field.
Questions about Semiconductor Wiring Technology: 1. How does this semiconductor wiring technology improve the performance of electronic devices? - This technology enhances the electrical connections in semiconductor devices, leading to improved reliability and efficiency.
2. What are the potential challenges in implementing this advanced wiring technology in semiconductor manufacturing? - Challenges may include optimizing the manufacturing process, ensuring compatibility with existing systems, and managing costs effectively.
Original Abstract Submitted
a semiconductor device includes a semiconductor element, a first wiring member electrically connected to a first main electrode on a first surface of the semiconductor element, a second wiring member electrically connected to a second main electrode on a second surface of the semiconductor element, a signal terminal connected to a signal pad on the second surface through a bonding wire. the second wiring member includes an insulating base material, a front surface metal body on a front surface of the insulating base material adjacent to the semiconductor element, and a back surface metal body on a back surface. an end portion of the front surface metal body is located between an end portion of a bonding target to which the front surface metal body is bonded and an end portion of the semiconductor element in an arrangement direction of the semiconductor element and the signal terminal.
