Delphi technologies ip limited (20240107675). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract
Contents
- 1 SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
Organization Name
delphi technologies ip limited
Inventor(s)
David Paul Buehler of Noblesville IN (US)
Kevin M. Gertiser of Carmel IN (US)
David W. Ihms of Kokomo IN (US)
Mark Wendell Gose of Kokomo IN (US)
SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240107675 titled 'SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
Simplified Explanation
The patent application describes a power module with two substrates, each extending from one end to the other, with a semiconductor die coupled to the inner surface of each substrate. The first substrate is longitudinally offset from the second substrate.
- The power module includes a first substrate with an inner surface and a semiconductor die attached to it.
- A second substrate is also present with a semiconductor die attached to its inner surface, and it is longitudinally offset from the first substrate.
Potential Applications
The technology described in the patent application could be used in various power electronics applications, such as inverters, converters, and motor drives.
Problems Solved
This technology helps in improving the thermal performance and efficiency of power modules by providing a unique substrate arrangement that allows for better heat dissipation and electrical performance.
Benefits
The power module design offers improved thermal management, higher power density, and enhanced reliability compared to traditional power module configurations.
Potential Commercial Applications
The technology could find applications in electric vehicles, renewable energy systems, industrial automation, and other high-power electronic devices.
Possible Prior Art
One possible prior art could be power modules with single substrates and semiconductor dies attached directly to them without the offset arrangement described in this patent application.
Unanswered Questions
How does the offset arrangement impact the electrical performance of the power module?
The offset arrangement may affect the electrical characteristics of the power module, such as parasitic capacitance and inductance, but the patent application does not provide specific details on this aspect.
What materials are used for the substrates in the power module?
The patent application does not mention the specific materials used for the substrates, which could be crucial for understanding the thermal and electrical properties of the power module.
Original Abstract Submitted
a power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a semiconductor die coupled to the inner surface of the first substrate; and a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate.
