Dell products l.p. (20240179874). VARIABLE TOPOGRAPHY HEAT SINK FINS simplified abstract

VARIABLE TOPOGRAPHY HEAT SINK FINS

Organization Name

dell products l.p.

Inventor(s)

TIMOTHY M. Lambert of Austin TX (US)

ERIC MICHAEL Tunks of Austin TX (US)

DANIEL Alvarado of Pflugerville TX (US)

VARIABLE TOPOGRAPHY HEAT SINK FINS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240179874 titled 'VARIABLE TOPOGRAPHY HEAT SINK FINS

Simplified Explanation

The patent application describes methods, systems, and devices for providing computer-implemented services using hardware components that generate heat. A heat sink assembly is used to manage the heat generated by the hardware components, with features for adjusting its shape and size to accommodate other nearby components.

• The patent application focuses on providing computer-implemented services using hardware components that generate heat.
• A heat sink assembly is utilized to manage the heat generated by the hardware components.
• The heat sink assembly includes features for adjusting its shape and size to accommodate other nearby components.
• By accommodating other components, the heat sink assembly can be used in spaces that would otherwise be unusable for thermal dissipation purposes due to the risk of mechanical interference.

Potential Applications

The technology described in the patent application could be applied in various industries such as:

• Data centers
• Telecommunications
• Automotive
• Aerospace

Problems Solved

The technology addresses the following problems:

• Efficient heat management in computer systems
• Space constraints for thermal dissipation components
• Risk of mechanical interference between heat sink assemblies and other components

Benefits

The technology offers the following benefits:

• Improved thermal performance of hardware components
• Enhanced reliability and longevity of computer systems
• Increased flexibility in system design and layout

Potential Commercial Applications

The technology could be commercially applied in:

• Server farms
• Networking equipment
• Automotive electronics
• Aerospace systems

Possible Prior Art

One possible prior art could be the use of traditional heat sink assemblies in computer systems. However, the unique feature of adjusting the shape and size of the heat sink assembly to accommodate other components sets this technology apart.

How does this technology compare to existing heat management solutions in terms of efficiency and cost-effectiveness?

The patent application does not provide a direct comparison with existing heat management solutions in terms of efficiency and cost-effectiveness. Further research or testing may be needed to evaluate these aspects.

What are the potential challenges or limitations of implementing this technology in different types of computer systems or devices?

The patent application does not discuss potential challenges or limitations of implementing this technology in different types of computer systems or devices. Additional studies or case studies may be required to identify and address any such challenges.

Original Abstract Submitted

methods, systems, and devices for providing computer-implemented services are disclosed. to provide the computer-implemented services, hardware components that generate heat may be used. to manage the heat generated by the hardware components, a heat sink assembly may be used. the heat sink assembly may include features for adjusting its shape and/or size to accommodate other nearby components. by accommodating other components, the heat sink assembly may be used in spaces that would otherwise be unusable for thermal dissipation purposes due to the risk of mechanical interference between the heat sink assembly and the other components.