Dell products l.p. (20240178867). MULTIPLE TRANSCEIVER COOLING SYSTEM simplified abstract
Contents
- 1 MULTIPLE TRANSCEIVER COOLING SYSTEM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MULTIPLE TRANSCEIVER COOLING SYSTEM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
MULTIPLE TRANSCEIVER COOLING SYSTEM
Organization Name
Inventor(s)
Yen-Chih Chen of New Taipei City (TW)
Shih-Huai Cho of New Taipei City (TW)
MULTIPLE TRANSCEIVER COOLING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178867 titled 'MULTIPLE TRANSCEIVER COOLING SYSTEM
Simplified Explanation
The patent application describes a multiple transceiver cooling system for networking devices, which includes a plurality of transceiver device chassis positioned adjacent to each other and a multiple transceiver heat dissipation device that engages each of the chassis to dissipate heat generated by the transceiver devices.
- The system includes a networking device and multiple transceiver device chassis.
- Each chassis is configured to receive a transceiver device.
- A multiple transceiver heat dissipation device engages each chassis to dissipate heat.
- Heat generated by transceiver devices is transferred to a heat dissipation element.
- The heat is dissipated using the heat dissipation element.
Potential Applications
The cooling system can be used in data centers, telecommunications networks, and other networking environments where multiple transceiver devices are used.
Problems Solved
1. Overheating of transceiver devices in close proximity. 2. Inefficient heat dissipation leading to performance issues.
Benefits
1. Improved cooling efficiency. 2. Enhanced performance and reliability of transceiver devices. 3. Cost-effective solution for managing heat in networking devices.
Potential Commercial Applications
Optimizing cooling systems for networking devices in various industries, including telecommunications, data centers, and IT infrastructure management.
Possible Prior Art
One possible prior art could be a similar cooling system for server racks or networking equipment, but with a different design or approach to heat dissipation.
Unanswered Questions
How does the system handle different heat dissipation requirements for various transceiver devices?
The patent application does not provide specific details on how the cooling system adapts to the varying heat dissipation needs of different transceiver devices. Further information on this aspect would be beneficial for understanding the system's flexibility and scalability.
What materials are used in the heat dissipation element, and how does it impact the overall performance of the cooling system?
The patent application does not delve into the specific materials used in the heat dissipation element or their impact on the system's efficiency. Exploring this aspect could shed light on the system's durability, effectiveness, and long-term performance.
Original Abstract Submitted
a multiple transceiver cooling system includes a networking device, a plurality of transceiver device chassis that are included in the networking device, that are positioned adjacent each other, and that are each configured to receive a respective transceiver device, and a multiple transceiver heat dissipation device that engages each of the plurality of transceiver device chassis. with the multiple transceiver heat dissipation device engaging each of the plurality of transceiver device chassis, the multiple transceiver heat dissipation device may receive heat generated by respective transceiver devices located in the plurality of transceiver device chassis, transfer the heat to a heat dissipation element, and dissipate the heat using the heat dissipation element.
