DOWA METALTECH CO., LTD. Patent Application Trends in 2024
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Contents
DOWA METALTECH CO., LTD. Patent Filing Activity
DOWA METALTECH CO., LTD. patent applications in 2024
Top 10 Technology Areas
- H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- B22D19/02 (CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES (shaping of plastics or substances in a plastic state)
- B22D19/04 (CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES (shaping of plastics or substances in a plastic state)
- B22D21/007 (Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedure; Selection of compositions therefor {(non-ferrous ingots)
- C22C21/00 (Alloys based on aluminium)
- H01L21/4807 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups)
- C22C1/03 (ALLOYS (flints)
- C25D3/46 (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR)
- C25D5/12 (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR)
- C22C9/06 (ALLOYS (flints)
Emerging Technology Areas
- H01H1/021 (Composite material)
- H01R43/16 (for manufacturing contact members, e.g. by punching and by bending)
- H01R13/03 (ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS)
- H01B5/00 (Non-insulated conductors or conductive bodies characterised by their form)
- B32B15/018 (all layers being exclusively metallic {(making layered metal workpieces by pressure cladding)
- C30B28/04 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,)
- C30B29/02 (Elements)
- C25D5/617 (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR)
- C25D5/10 (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR)
- C22F1/08 (of copper or alloys based thereon)
Top Inventors
- Koji KOBAYASHI (2 patents)
- Yosuke SATO (2 patents)
- Yutaro HIRAI (2 patents)
- Kentaro ARAI (2 patents)
- Ryosuke MIYAHARA (1 patent)
- Tomohiro KAWAKAMI (1 patent)
- Yuta SASAI (1 patent)
- Tomotsugu AOYAMA (1 patent)
- Hiroto NARIEDA (1 patent)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
DOWA METALTECH CO., LTD. Inventor States 2024 - Up to June 2024
Categories:
- Pages with broken file links
- DOWA METALTECH CO., LTD.
- Companies
- CPC H01L23/3735
- CPC B22D19/02
- CPC B22D19/04
- CPC B22D21/007
- CPC C22C21/00
- CPC H01L21/4807
- CPC C22C1/03
- CPC C22C9/06
- CPC C22C9/02
- CPC C22F1/08
- CPC C25D5/10
- CPC C25D3/46
- CPC C25D5/617
- CPC C25D5/12
- CPC C30B29/02
- CPC C30B28/04
- CPC B32B15/018
- CPC H01B5/00
- CPC H01R13/03
- CPC H01R43/16
- CPC H01H1/021
- Patent Trends by Company in 2024
