Cisco technology, inc. (20240304512). LOAD PLATE WITH FEEDTHROUGH simplified abstract
Contents
LOAD PLATE WITH FEEDTHROUGH
Organization Name
Inventor(s)
Norbert Schlepple of Macungie PA (US)
Vipulkumar K. Patel of Breinigsville PA (US)
Aparna R. Prasad of San Jose CA (US)
LOAD PLATE WITH FEEDTHROUGH - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240304512 titled 'LOAD PLATE WITH FEEDTHROUGH
The patent application describes an apparatus with a substrate, an integrated circuit, and a load plate designed to absorb heat from the integrated circuit. The load plate includes a body with an extender that creates a cavity between the extender and the integrated circuit.
- The apparatus includes a substrate, an integrated circuit, and a load plate.
- The load plate is positioned on the integrated circuit to absorb heat.
- The load plate has a body with an extender that creates a cavity for heat dissipation.
- The extender defines an aperture aligned with the integrated circuit.
- The design allows for efficient cooling of the integrated circuit.
Potential Applications: - This technology can be used in electronic devices to improve thermal management. - It can be applied in high-performance computing systems to prevent overheating. - The apparatus can enhance the reliability and longevity of integrated circuits in various applications.
Problems Solved: - Addresses the issue of heat buildup in integrated circuits. - Improves thermal efficiency and performance of electronic devices. - Enhances the overall reliability of integrated circuits.
Benefits: - Efficient heat dissipation for integrated circuits. - Improved performance and reliability of electronic devices. - Extended lifespan of integrated circuits.
Commercial Applications: Title: "Enhanced Thermal Management System for Integrated Circuits" This technology can be utilized in smartphones, laptops, servers, and other electronic devices to enhance thermal performance. It can also be integrated into automotive electronics and industrial equipment for improved reliability.
Questions about the technology: 1. How does the extender in the load plate help in dissipating heat efficiently?
- The extender creates a cavity that allows for better airflow and heat dissipation from the integrated circuit.
2. What are the potential long-term benefits of implementing this thermal management system in electronic devices?
- Implementing this system can lead to improved performance, reliability, and longevity of electronic devices.
Original Abstract Submitted
an apparatus includes a substrate, an integrated circuit positioned on the substrate, and a load plate positioned on the integrated circuit such that the load plate is arranged to absorb heat from the integrated circuit. the load plate includes a body and an extender. the body includes an upper surface and a bottom surface. the bottom surface contacts the integrated circuit such that the bottom surface is between the integrated circuit and the upper surface. a portion of the body extends beyond the integrated circuit. the extender is coupled to the portion of the body such that the extender extends from the bottom surface to define a cavity between the extender and the integrated circuit. the extender defines an aperture aligned with the integrated circuit.
