Chengdu boe optoelectronics technology co., ltd. (20240304586). CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONIC DEVICE AND MANUFACTURE METHOD THEREFOR simplified abstract

CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONIC DEVICE AND MANUFACTURE METHOD THEREFOR

Organization Name

chengdu boe optoelectronics technology co., ltd.

Inventor(s)

Shaopeng Li of Beijing (CN)

Weiben Zhang of Beijing (CN)

Jianhua Shu of Beijing (CN)

Rongkun Fan of Beijing (CN)

Qiang Gou of Beijing (CN)

Tao Su of Beijing (CN)

Hao Deng of Beijing (CN)

Tianjun Deng of Beijing (CN)

Xiaolong Tang of Beijing (CN)

Wenze Li of Beijing (CN)

Cheng Zhang of Beijing (CN)

Fakui Sun of Beijing (CN)

Jing Zhang of Beijing (CN)

Yuan Liu of Beijing (CN)

Dingjie Huang of Beijing (CN)

CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONIC DEVICE AND MANUFACTURE METHOD THEREFOR - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240304586 titled 'CONDUCTIVE ADHESIVE FILM AND FABRICATION METHOD THEREFOR, ELECTRONIC DEVICE AND MANUFACTURE METHOD THEREFOR

The abstract describes a conductive adhesive film consisting of a first film layer with electrode contact regions and a conductive particle layer. The first film layer has gap structures in the non-contact region, and the conductive particle layer contains conductive particles that overlap with the electrode contact regions.

• The conductive adhesive film includes a first film layer with electrode contact regions and a conductive particle layer.
• The first film layer has gap structures in the non-contact region to separate the electrode contact regions.
• The conductive particle layer contains conductive particles that overlap with the electrode contact regions.
• The film is designed to provide conductivity and adhesion in electronic applications.
• The innovative design ensures efficient electrical contact between components.

Potential Applications: - Electronics manufacturing - Circuit board assembly - Sensor technology

Problems Solved: - Ensures reliable electrical connections - Improves adhesion in electronic devices

Benefits: - Enhanced conductivity - Improved reliability in electronic applications - Simplified manufacturing processes

Commercial Applications: Title: "Innovative Conductive Adhesive Film for Electronics Manufacturing" This technology can be used in various industries such as consumer electronics, automotive, and telecommunications for efficient assembly and improved performance of electronic devices.

Questions about the technology: 1. How does the design of the conductive adhesive film improve electrical contact in electronic applications? 2. What are the potential cost-saving benefits of using this innovative film in electronics manufacturing processes?

Original Abstract Submitted

a conductive adhesive film is disclosed. the conductive adhesive film includes a first film layer and a conductive particle layer. the first film layer has a plurality of electrode contact regions and a non-contact region separating the plurality of electrode contact regions. the first film layer has a plurality of gap structures, and the plurality of gap structures are located at least in the non-contact region. the conductive particle layer is located on a side of the first film layer. the conductive particle layer includes conductive particles. an orthographic projection of the conductive particles on the first film layer overlaps with at least a portion of each electrode contact region.