Chengdu boe optoelectronics technology co., ltd. (20240243083). DRIVER IC AND DISPLAY DEVICE simplified abstract

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DRIVER IC AND DISPLAY DEVICE

Organization Name

chengdu boe optoelectronics technology co., ltd.

Inventor(s)

Huatao Li of Beijing (CN)

Zhiguang Zhang of Beijing (CN)

Zhongjie Wang of Beijing (CN)

Pan Zhao of Beijing (CN)

Zhilliang Jiang of Beijing (CN)

Ziyang Yu of Beijing (CN)

Shilong Wang of Beijing (CN)

DRIVER IC AND DISPLAY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240243083 titled 'DRIVER IC AND DISPLAY DEVICE

The abstract describes a driver IC and a display device, with the driver IC containing at least one gate-on-array (GOA) pad area. Each GOA pad area consists of multiple first pads organized in rows and columns, with each column divided into at least two groups of first pads that are electrically connected within each group. The driver IC also includes leads that are connected to the first pad groups, with each group linked to a different lead.

  • The driver IC features a unique layout of first pads in GOA pad areas, enhancing electrical connectivity and signal distribution.
  • The division of first pads into independent groups allows for efficient organization and management of electrical connections.
  • The use of multiple leads ensures that each group of first pads is connected to a separate lead, optimizing signal transmission and control.

Potential Applications: - This technology can be applied in various display devices such as LCD screens, OLED panels, and LED displays. - It can also be utilized in automotive displays, medical monitors, and consumer electronics for improved performance and reliability.

Problems Solved: - Enhances electrical connectivity and signal distribution within the driver IC. - Optimizes the layout of first pads for efficient organization and management of connections. - Improves the overall performance and reliability of display devices.

Benefits: - Increased efficiency in signal transmission and control. - Enhanced reliability and performance of display devices. - Simplified design and layout for easier integration into various electronic products.

Commercial Applications: Title: Advanced Driver IC Technology for Enhanced Display Performance This technology can be commercially used in the manufacturing of LCD screens, OLED panels, LED displays, automotive displays, medical monitors, and consumer electronics. The improved electrical connectivity and signal distribution offered by this innovation can lead to higher quality and more reliable display devices in the market.

Prior Art: Researchers and developers in the field of display technology can explore prior art related to driver IC layouts, signal distribution methods, and electrical connectivity in display devices to understand the evolution of similar technologies.

Frequently Updated Research: Researchers in the field of semiconductor technology and display devices may be conducting ongoing studies on optimizing driver IC layouts, improving signal distribution efficiency, and enhancing electrical connectivity in electronic components. Stay updated on the latest advancements in these areas to leverage cutting-edge innovations in display technology.

Questions about Driver IC Technology: 1. How does the unique layout of first pads in the GOA pad areas contribute to improved signal distribution and electrical connectivity within the driver IC? 2. What are the potential implications of using multiple leads to connect different groups of first pads in terms of signal transmission efficiency and control?


Original Abstract Submitted

provided are a driver ic and a display device. the driver ic includes at least one goa pad area. each of the at least one goa pad area includes a plurality of first pads arranged in a plurality of rows and a plurality of columns. each of the plurality of columns of the first pads is divided into at least two first pad groups arranged independently of each other. each of the at least two of the first pad groups includes at least two of the first pads adjacent to each other, and the first pads in each of the first pad groups are electrically connected with each other. the driver ic further includes a plurality of leads electrically connected with the first pad groups, and each of the first pad groups is electrically connected with a different lead.