Category:Yutaro HIRAI

From WikiPatents
Jump to navigation Jump to search

Yutaro HIRAI

Executive Summary

Yutaro HIRAI is an inventor who has filed 2 patents. Their primary areas of innovation include PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR (2 patents), PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR (2 patents), PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR (1 patents), and they have worked with companies such as DOWA METALTECH CO., LTD. (2 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations).

Patent Filing Activity

Yutaro HIRAI Monthly Patent Applications.png

Technology Areas

Yutaro HIRAI Top Technology Areas.png

List of Technology Areas

  • C25D3/46 (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR): 2 patents
  • C25D5/12 (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR): 2 patents
  • C25D5/10 (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR): 1 patents
  • C25D5/617 (PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR): 1 patents
  • C30B29/02 (Elements): 1 patents
  • C30B28/04 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 1 patents
  • B32B15/018 (all layers being exclusively metallic {(making layered metal workpieces by pressure cladding): 1 patents
  • H01B5/00 (Non-insulated conductors or conductive bodies characterised by their form): 1 patents
  • H01R13/03 (ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS): 1 patents
  • H01R43/16 (for manufacturing contact members, e.g. by punching and by bending): 1 patents
  • H01H1/021 (Composite material): 1 patents

Companies

Yutaro HIRAI Top Companies.png

List of Companies

  • DOWA METALTECH CO., LTD.: 2 patents

Collaborators

Subcategories

This category has the following 3 subcategories, out of 3 total.

K

Y