Category:Yu-Cheng Tung

Yu-Cheng Tung

Executive Summary

Yu-Cheng Tung is an inventor who has filed 12 patents. Their primary areas of innovation include ELECTRONIC MEMORY DEVICES (5 patents), ELECTRONIC MEMORY DEVICES (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as Fujian Jinhua Integrated Circuit Co., Ltd. (12 patents). Their most frequent collaborators include (7 collaborations), (3 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H10B12/315 (ELECTRONIC MEMORY DEVICES): 5 patents
• H10B12/0335 (ELECTRONIC MEMORY DEVICES): 4 patents
• H01L28/91 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L27/10823 (including a plurality of individual components in a repetitive configuration): 2 patents
• H10B12/482 (ELECTRONIC MEMORY DEVICES): 2 patents
• G11C5/063 (STATIC STORES (semiconductor memory devices): 2 patents
• H10B12/033 (ELECTRONIC MEMORY DEVICES): 2 patents
• H01L28/75 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B12/03 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B12/09 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B12/34 (ELECTRONIC MEMORY DEVICES): 1 patents
• H01L27/10876 (including a plurality of individual components in a repetitive configuration): 1 patents
• H01L27/10885 (including a plurality of individual components in a repetitive configuration): 1 patents
• H01L27/10888 (including a plurality of individual components in a repetitive configuration): 1 patents
• H01L21/76831 ({in via holes or trenches, e.g. non-conductive sidewall liners}): 1 patents
• H01L21/76843 ({formed in openings in a dielectric}): 1 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/53223 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/53238 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/53266 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/0649 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/10808 (including a plurality of individual components in a repetitive configuration): 1 patents
• H01L27/10855 (including a plurality of individual components in a repetitive configuration): 1 patents
• H01L27/10891 (including a plurality of individual components in a repetitive configuration): 1 patents
• H01L29/66969 ({of devices having semiconductor bodies not comprising group 14 or group 13/15 materials (comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide): 1 patents
• C23C16/407 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/45529 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/45553 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• H01L21/02554 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/0262 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/24 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/78648 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/7869 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/78693 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/78696 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/0338 ({Process specially adapted to improve the resolution of the mask}): 1 patents
• H01L21/0335 ({characterised by their behaviour during the process, e.g. soluble masks, redeposited masks}): 1 patents
• H01L21/0337 ({characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment}): 1 patents
• H01L21/76892 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L23/528 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H10B12/31 (ELECTRONIC MEMORY DEVICES): 1 patents
• H01L21/76224 ({using trench refilling with dielectric materials (trench filling with polycristalline silicon): 1 patents
• H10B12/485 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B12/488 (ELECTRONIC MEMORY DEVICES): 1 patents

Companies

List of Companies

• Fujian Jinhua Integrated Circuit Co., Ltd.: 12 patents

Collaborators

• Janbo Zhang (7 collaborations)
• Yifei Yan (3 collaborations)
• Yi-Wang Jhan (2 collaborations)
• Gang-Yi Lin (2 collaborations)
• Chia-Wei Wu (2 collaborations)
• Fu-Che Lee (1 collaborations)
• An-Chi Liu (1 collaborations)
• Ken-Li Chen (1 collaborations)
• Xiaopei Fang (1 collaborations)