Category:Yifan WU

Yifan WU

Executive Summary

Yifan WU is an inventor who has filed 5 patents. Their primary areas of innovation include Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate (3 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (2 patents), {Via connections through the substrates, e.g. pins going through the substrate, coaxial cables ( (2 patents), and they have worked with companies such as Beijing BOE Optoelectronics Technology Co., Ltd. (5 patents). Their most frequent collaborators include (5 collaborations), (5 collaborations), (5 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents
• H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 2 patents
• H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 2 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/15 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H05K2201/10015 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
• H05K2201/1003 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 2 patents
• H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49833 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L2224/16237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H05K1/181 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
• H05K2201/10378 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/182 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
• H03H9/542 (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (measuring, testing): 1 patents
• H03H3/02 (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (measuring, testing): 1 patents
• H03H9/133 (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (measuring, testing): 1 patents
• H03H9/17 (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (measuring, testing): 1 patents
• H01L23/645 ({Inductive arrangements (): 1 patents
• H05K1/0306 (Use of materials for the substrate): 1 patents
• H05K1/115 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K3/4038 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/09509 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents

Companies

List of Companies

• Beijing BOE Optoelectronics Technology Co., Ltd.: 5 patents

Collaborators

• Yue LI (5 collaborations)
• Yuelei XIAO (5 collaborations)
• Yulin FENG (5 collaborations)
• Qichang AN (5 collaborations)
• Kidong HAN (4 collaborations)
• Jingshu ZHANG (3 collaborations)
• Biqi LI (3 collaborations)
• Huiying LI (3 collaborations)
• Zijian WANG (2 collaborations)
• Xiaodong LI (2 collaborations)
• Xue CAO (2 collaborations)
• Shuai XU (1 collaborations)
• Bin ZHAO (1 collaborations)
• Yingwei LIU (1 collaborations)
• Rui MA (1 collaborations)
• Quanyue LI (1 collaborations)
• Song CHEN (1 collaborations)
• Qianyu GUO (1 collaborations)
• Lihui WANG (1 collaborations)
• Qiuxu WEI (1 collaborations)
• Yanfei REN (1 collaborations)
• Wenbo CHANG (1 collaborations)
• Yi ZHOU (1 collaborations)
• Feng QU (1 collaborations)