Category:Xiaopeng WU

Xiaopeng WU

Executive Summary

Xiaopeng WU is an inventor who has filed 5 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), {Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads ( (2 patents), and they have worked with companies such as ROHM CO., LTD. (5 patents). Their most frequent collaborators include (3 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L25/072 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 2 patents
• H01L23/49844 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L23/49575 (Lead-frames {or other flat leads (): 2 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/40 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49568 (Lead-frames {or other flat leads (): 1 patents
• H01L24/30 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49562 (Lead-frames {or other flat leads (): 1 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/30181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29639 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83447 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40137 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73221 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3736 ({Metallic materials (): 1 patents
• H01L2224/48247 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48472 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32257 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/13091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01029 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01013 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• ROHM CO., LTD.: 5 patents

Collaborators

• Kohei TANIKAWA (3 collaborations)
• Hiroto SAKAI (1 collaborations)
• Yuta OKAWAUCHI (1 collaborations)
• Ryosuke FUKUDA (1 collaborations)
• Oji SATO (1 collaborations)