Category:Wen-Chien Chen

Wen-Chien Chen

Executive Summary

Wen-Chien Chen is an inventor who has filed 8 patents. Their primary areas of innovation include MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se (4 patents), MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se (3 patents), MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se (3 patents), and they have worked with companies such as xMEMS Labs, Inc. (8 patents). Their most frequent collaborators include (7 collaborations), (4 collaborations), (3 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• B81B2203/0307 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 4 patents
• B81B2201/0257 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 3 patents
• B81B2203/0127 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 3 patents
• H04R1/2811 (Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means {(combinations of transducers with horns, i.e. front-loaded horns): 3 patents
• H04R2201/003 (Mems transducers or their use (of the electrostatic type): 3 patents
• H04R1/1016 ({Earpieces of the intra-aural type}): 2 patents
• B81B7/0061 (Microstructural systems; {Auxiliary parts of microstructural devices or systems}): 2 patents
• H04R1/025 ({Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture}): 2 patents
• H04R19/02 (Loudspeakers (): 2 patents
• H04R7/06 (LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS (generating mechanical vibrations in general): 2 patents
• H04R7/18 (at the periphery): 2 patents
• H04R31/003 ({for diaphragms or their outer suspension}): 2 patents
• B81C1/00158 (Manufacture or treatment of devices or systems in or on a substrate (): 2 patents
• B81B2203/01 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 2 patents
• B81C2203/051 (PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons): 2 patents
• H04R1/1041 ({Mechanical or electronic switches, or control elements (switches in general): 1 patents
• H04R2460/11 (Aspects relating to vents, e.g. shape, orientation, acoustic properties in ear tips of hearing devices to prevent occlusion): 1 patents
• B81B3/0021 (Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (): 1 patents
• B81B3/0051 (Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (): 1 patents
• B81B3/0072 (Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (): 1 patents
• H04R31/00 (Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general): 1 patents
• B81B2203/0163 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 1 patents
• B81B2207/03 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 1 patents
• H04R7/04 (Plane diaphragms): 1 patents
• H04R19/00 (Electrostatic transducers): 1 patents
• B81B3/0097 (Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes (): 1 patents
• B81B2203/0118 (MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se): 1 patents
• H04R1/24 (LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS (generating mechanical vibrations in general): 1 patents
• H04R1/023 ({Screens for loudspeakers}): 1 patents

Companies

List of Companies

• xMEMS Labs, Inc.: 8 patents

Collaborators

• Chiung C. Lo of San Jose CA (US) (7 collaborations)
• Chao-Yu Chen (4 collaborations)
• Chun-I Chang (3 collaborations)
• Jemm Yue Liang of Sunnyvale CA (US) (3 collaborations)
• Hai-Hung Wen (3 collaborations)
• Jye Ren (2 collaborations)
• Hao-Hsin Chang (2 collaborations)
• Kai-Chieh Chang (1 collaborations)
• Yuan-Shuang Liu (1 collaborations)
• Kuan-Ju Tseng (1 collaborations)
• Martin George Lim of Hillsborough CA (US) (1 collaborations)