Category:Takumi SANO

Takumi SANO

Executive Summary

Takumi SANO is an inventor who has filed 12 patents. Their primary areas of innovation include PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (5 patents), PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (4 patents), {using a single layer of sensing electrodes} (3 patents), and they have worked with companies such as Japan Display Inc. (12 patents). Their most frequent collaborators include (6 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H05K1/0283 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 5 patents
• H05K2201/10151 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 4 patents
• G06F3/0443 ({using a single layer of sensing electrodes}): 3 patents
• G06F2203/04102 (ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models): 2 patents
• H05K1/0269 ({Spark gaps}): 1 patents
• H05K2201/09263 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K1/032 (Use of materials for the substrate): 1 patents
• H05K1/0306 (Use of materials for the substrate): 1 patents
• H05K1/118 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K3/103 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/10106 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• G06F3/04146 ({using pressure sensitive conductive elements delivering a boolean signal and located between crossing sensing lines, e.g. located between X and Y sensing line layers}): 1 patents
• G01L1/205 (MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing): 1 patents
• G06F3/0412 ({Digitisers structurally integrated in a display}): 1 patents
• G06F2203/04105 (ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models): 1 patents
• G06F3/044 (by capacitive means): 1 patents
• G06F2203/04108 (ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models): 1 patents
• G06F3/04166 ({Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving (Synchronisation with the driving of the display or the backlighting unit to avoid interferences generated internally): 1 patents
• G06F3/0446 ({using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes}): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L23/5387 ({Flexible insulating substrates (): 1 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
• H01L27/124 (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents
• H01L25/16 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L27/1218 (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents

Companies

List of Companies

• Japan Display Inc.: 12 patents

Collaborators

• Masatomo HISHINUMA (6 collaborations)
• Yasushi TOMIOKA (2 collaborations)
• Akio MURAYAMA (2 collaborations)
• Shinichiro OKA (2 collaborations)
• Yosuke HYODO (1 collaborations)
• Hiroumi KINJO (1 collaborations)