Category:Takayuki OHBA

Takayuki OHBA

Executive Summary

Takayuki OHBA is an inventor who has filed 5 patents. Their primary areas of innovation include {Geometry or} layout of the interconnection structure {( (2 patents), to produce devices, e.g. integrated circuits, each consisting of a plurality of components (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as ADVANTEST CORPORATION (5 patents). Their most frequent collaborators include (5 collaborations), (4 collaborations), (4 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L23/528 ({Geometry or} layout of the interconnection structure {(): 2 patents
• H01L21/823871 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
• H01L27/092 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/76898 ({formed through a semiconductor substrate}): 2 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 2 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 2 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/367 (Cooling facilitated by shape of device {(): 1 patents
• H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/291 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/427 (Cooling by change of state, e.g. use of heat pipes {(by liquefied gas): 1 patents
• H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• ADVANTEST CORPORATION: 5 patents

Collaborators

• Shinji SUGATANI (5 collaborations)
• Koji SAKUI (4 collaborations)
• Norio CHUJO (4 collaborations)
• Tadashi FUKUDA (2 collaborations)