Category:Swarnal BORTHAKUR of Boise ID (US)

Swarnal BORTHAKUR of Boise ID (US)

Executive Summary

Swarnal BORTHAKUR of Boise ID (US) is an inventor who has filed 3 patents. Their primary areas of innovation include {Microlenses} (2 patents), {Assemblies, i.e. Hybrid structures} (2 patents), {Interconnect structures} (2 patents), and they have worked with companies such as SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (3 patents). Their most frequent collaborators include (2 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L27/14627 ({Microlenses}): 2 patents
• H01L27/14634 ({Assemblies, i.e. Hybrid structures}): 2 patents
• H01L27/14636 ({Interconnect structures}): 2 patents
• H01L27/14685 ({Process for coatings or optical elements}): 2 patents
• H01L27/1464 ({Back illuminated imager structures}): 1 patents
• H01L27/14621 ({Colour filter arrangements}): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/06 ({of a plurality of bonding areas}): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/96 ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 1 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/06181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80357 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/96 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/05442 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/14623 ({Optical shielding}): 1 patents
• H01L27/14645 ({Colour imagers}): 1 patents

Companies

List of Companies

• SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: 3 patents

Collaborators

• Marc Allen SULFRIDGE of Boise ID (US) (2 collaborations)
• Tomas GEURTS (1 collaborations)
• Mario M. PELELLA of Mountain View CA (US) (1 collaborations)
• Chandrasekharan KOTHANDARAMAN of New York NY (US) (1 collaborations)
• Yusheng LIN of Phoenix AZ (US) (1 collaborations)
• Larry Duane KINSMAN of Redding CA (US) (1 collaborations)
• William CROFOOT of Nampa ID (US) (1 collaborations)