Category:Shunsuke TERANISHI

Shunsuke TERANISHI

Executive Summary

Shunsuke TERANISHI is an inventor who has filed 4 patents. Their primary areas of innovation include Mechanical treatment, e.g. grinding, polishing, cutting {( (2 patents), {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected} (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as DISCO CORPORATION (4 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 2 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 2 patents
• H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 2 patents
• H01L2224/80013 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/8023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/80894 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/80948 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/6836 ({Wafer tapes, e.g. grinding or dicing support tapes (adhesive tapes in general): 2 patents
• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents
• H01L21/02076 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/268 (Bombardment with radiation {(): 1 patents
• H01L2223/5446 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68327 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68386 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02315 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• DISCO CORPORATION: 4 patents

Collaborators

• Kai MINAMIZAKI (2 collaborations)
• Akira MIZUTANI (2 collaborations)
• Naoko YAMAMOTO (1 collaborations)