Category:Ryosuke FUKUDA

Ryosuke FUKUDA

Executive Summary

Ryosuke FUKUDA is an inventor who has filed 6 patents. Their primary areas of innovation include Lead-frames {or other flat leads ( (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), and they have worked with companies such as ROHM CO., LTD. (6 patents). Their most frequent collaborators include (5 collaborations), (3 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L23/49575 (Lead-frames {or other flat leads (): 4 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/40 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/49562 (Lead-frames {or other flat leads (): 2 patents
• H01L2924/13091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/48175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/73221 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/73263 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/18 ({High density interconnect [HDI] connectors; Manufacturing methods related thereto (interconnection structure between a plurality of semiconductor chips): 1 patents
• H01L2224/48247 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/182 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/4952 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49568 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 1 patents
• H01L23/31 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/367 (Cooling facilitated by shape of device {(): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L2924/1207 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49517 (Lead-frames {or other flat leads (): 1 patents
• H01L2224/40175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49844 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L23/49861 ({Lead-frames fixed on or encapsulated in insulating substrates (): 1 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/072 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29575 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40095 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40139 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/8383 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/30107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/35121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/40137 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• ROHM CO., LTD.: 6 patents

Collaborators

• Kohei TANIKAWA (5 collaborations)
• Kenji HAYASHI (3 collaborations)
• Shinya UMEKI (1 collaborations)
• Yuta KAWAMOTO (1 collaborations)
• Hiroto SAKAI (1 collaborations)
• Yuta OKAWAUCHI (1 collaborations)
• Xiaopeng WU (1 collaborations)