Category:Paul M. Enquist of Cary NC (US)

Paul M. Enquist of Cary NC (US)

Executive Summary

Paul M. Enquist of Cary NC (US) is an inventor who has filed 2 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), {Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group (2 patents), Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups (1 patents), and they have worked with companies such as ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (2 patents). Their most frequent collaborators include (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 2 patents
• H01L21/50 (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups): 1 patents
• H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• H01L24/89 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0345 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/03452 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/03462 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/036 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/03616 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/03825 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05007 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05026 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05078 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05082 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0556 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0557 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05571 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05573 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05666 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05676 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05681 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05684 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05686 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08112 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08123 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80031 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80035 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80047 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80075 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80097 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80099 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/8019 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80194 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80935 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80986 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06513 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76898 ({formed through a semiconductor substrate}): 1 patents
• H01L21/8221 ({Three dimensional integrated circuits stacked in different levels}): 1 patents
• H01L23/3171 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
• H01L25/074 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
• H01L27/14618 ({Containers}): 1 patents
• H01L27/14621 ({Colour filter arrangements}): 1 patents
• H01L27/14627 ({Microlenses}): 1 patents
• H01L27/14632 ({Wafer-level processed structures}): 1 patents
• H01L27/14634 ({Assemblies, i.e. Hybrid structures}): 1 patents
• H01L27/14636 ({Interconnect structures}): 1 patents
• H01L27/14687 ({Wafer level processing}): 1 patents
• H01L27/1469 ({Assemblies, i.e. hybrid integration}): 1 patents
• H01L2224/02379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1434 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.: 2 patents

Collaborators

• Belgacem Haba of Saratoga CA (US) (1 collaborations)