Category:Naoko YAMAMOTO

Naoko YAMAMOTO

Executive Summary

Naoko YAMAMOTO is an inventor who has filed 4 patents. Their primary areas of innovation include with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies (3 patents), {Wafer tapes, e.g. grinding or dicing support tapes (adhesive tapes in general (3 patents), {Making grooves, e.g. cutting} (3 patents), and they have worked with companies such as DISCO CORPORATION (4 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 3 patents
• H01L21/6836 ({Wafer tapes, e.g. grinding or dicing support tapes (adhesive tapes in general): 3 patents
• H01L21/3043 ({Making grooves, e.g. cutting}): 3 patents
• H01L21/02076 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/268 (Bombardment with radiation {(): 2 patents
• H01L2221/68327 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses): 2 patents
• H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents
• H01L2223/5446 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2221/68386 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/3065 (Plasma etching; Reactive-ion etching): 1 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
• B23K26/38 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents

Companies

List of Companies

• DISCO CORPORATION: 4 patents

Collaborators

• Shunsuke TERANISHI (1 collaborations)
• Tomoaki SUGIYAMA (1 collaborations)