Category:Mitsuru MIYAZAKI

Mitsuru MIYAZAKI

Executive Summary

Mitsuru MIYAZAKI is an inventor who has filed 3 patents. Their primary areas of innovation include Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se (2 patents), CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes (1 patents), CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes (1 patents), and they have worked with companies such as EBARA CORPORATION (3 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/67046 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 2 patents
• B08B1/04 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• B08B1/02 (CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL (brushes): 1 patents
• B08B3/041 ({Cleaning travelling work}): 1 patents
• H01L21/67051 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• B08B1/32 (using rotary cleaning members): 1 patents
• B08B3/024 ({Cleaning by means of spray elements moving over the surface to be cleaned}): 1 patents
• B24B7/228 ({for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts): 1 patents
• H01L21/6719 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67219 ({comprising at least one polishing chamber (polishing apparatuses): 1 patents
• H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/68764 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• B25B5/16 (TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING): 1 patents

Companies

List of Companies

• EBARA CORPORATION: 3 patents

Collaborators

• Fumitoshi OIKAWA (2 collaborations)
• Koichi FUKAYA (2 collaborations)
• Tomoaki FUJIMOTO (1 collaborations)
• Takuya INOUE (1 collaborations)
• Daichi KONDO (1 collaborations)
• Hisajiro NAKANO (1 collaborations)