Category:Minglu Liu of Chandler AZ US
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Minglu Liu
Minglu Liu from Chandler AZ US has applied for patents in technology areas such as H01L23/15, H01L23/24, H01L23/367 with intel corporation.
Patents
Pages in category "Minglu Liu of Chandler AZ US"
The following 12 pages are in this category, out of 12 total.
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- Intel corporation (20250006569). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006571). METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING THIN FILM CAPACITORS
- Intel corporation (20250006609). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006610). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006611). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006612). METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS HAVING DIFFERENT COEFFICIENTS OF THERMAL EXPANSION
- Intel corporation (20250006613). METHODS AND APPARATUS FOR PACKAGE SUBSTRATES WITH STACKS OF GLASS LAYERS INCLUDING INTERCONNECT BRIDGES
- Intel corporation (20250006665). METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRENCH CAPACITORS
- Intel corporation (20250105209). HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE FIRST APPROACH
- Intel corporation (20250105222). HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILICON VIA BRIDGES WITH TOP DIE LAST APPROACH