Category:Michael J. SEDDON of Gilbert AZ (US)

Michael J. SEDDON of Gilbert AZ (US)

Executive Summary

Michael J. SEDDON of Gilbert AZ (US) is an inventor who has filed 8 patents. Their primary areas of innovation include with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies (5 patents), Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes (3 patents), Bombardment with radiation {( (2 patents), and they have worked with companies such as SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (8 patents). Their most frequent collaborators include (3 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 5 patents
• H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 3 patents
• H01L21/268 (Bombardment with radiation {(): 2 patents
• H01L23/12 (Mountings, e.g. non-detachable insulating substrates): 2 patents
• H01L21/6836 ({Wafer tapes, e.g. grinding or dicing support tapes (adhesive tapes in general): 2 patents
• H01L21/0274 (Making masks on semiconductor bodies for further photolithographic processing not provided for in group): 1 patents
• H01L21/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/32051 (Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers (manufacture of electrodes): 1 patents
• H01L21/32131 ({by physical means only}): 1 patents
• H01L22/20 ({Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps}): 1 patents
• H01L2223/5446 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/302 (Treatment of semiconductor bodies using processes or apparatus not provided for in groups): 1 patents
• H01L21/48 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3185 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/04 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/26 ({Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto}): 1 patents
• H01L2224/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5222 ({Capacitive arrangements or effects of, or between wiring layers (other capacitive arrangements): 1 patents
• H01L21/0226 ({the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides (adhesion layers or buffer layers): 1 patents
• H01L21/786 (the substrate being other than a semiconductor body, e.g. insulating body): 1 patents
• H01L23/34 (Arrangements for cooling, heating, ventilating or temperature compensation {; Temperature sensing arrangements (thermal treatment apparatus): 1 patents
• H01L21/02076 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/3043 ({Making grooves, e.g. cutting}): 1 patents
• B23K26/53 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• H01L23/145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/32 (Holders for supporting the complete device in operation, i.e. detachable fixtures (): 1 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses): 1 patents
• B21D11/10 (WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL (working or processing of wire): 1 patents
• H01L21/02035 ({Shaping}): 1 patents
• H01L21/76871 ({Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers}): 1 patents
• H01L21/32136 ({using plasmas}): 1 patents
• H01L21/32139 ({using masks}): 1 patents
• H01L2221/68327 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: 8 patents

Collaborators

• Francis J. CARNEY of Mesa AZ (US) (3 collaborations)
• Chee Hiong CHEW (1 collaborations)
• Soon Wei WANG (1 collaborations)
• Eiji KUROSE (1 collaborations)
• Mark GRISWOLD of Gilbert AZ (US) (1 collaborations)