Category:Micah Armstrong of Scottsdale AZ US

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Micah Armstrong

Micah Armstrong from Scottsdale AZ US has applied for patents in technology areas such as H01L23/538, H01L21/48, H01L23/00 with intel corporation.

Patents

THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVICE PACKAGES (20250006646)

Pages in category "Micah Armstrong of Scottsdale AZ US"

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I

Intel corporation (20250006646). THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVICE PACKAGES

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