Category:Masaya TOBA

Masaya TOBA

Executive Summary

Masaya TOBA is an inventor who has filed 4 patents. Their primary areas of innovation include Printed circuits structurally associated with non-printed electric components ({ (2 patents), {by electroless plating (adhesives therefor (2 patents), {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates} (2 patents), and they have worked with companies such as Resonac Corporation (3 patents), RESONAC CORPORATION (1 patents). Their most frequent collaborators include (4 collaborations), (3 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H05K1/181 (Printed circuits structurally associated with non-printed electric components ({): 2 patents
• H05K3/181 ({by electroless plating (adhesives therefor): 2 patents
• H05K3/022 ({Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates}): 2 patents
• H05K3/1208 (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
• H05K3/107 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K3/025 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H05K2201/10553 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/0358 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2203/1377 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/0209 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents

Companies

List of Companies

• Resonac Corporation: 3 patents
• RESONAC CORPORATION: 1 patents

Collaborators

• Kazuyuki MITSUKURA (4 collaborations)
• Masaki YAMAGUCHI (3 collaborations)
• Kei TOGASAKI (1 collaborations)
• Kenichi IWASHITA (1 collaborations)
• Keishi ONO (1 collaborations)
• Mao NARITA (1 collaborations)