Category:Marc Allen SULFRIDGE of Boise ID (US)

Marc Allen SULFRIDGE of Boise ID (US)

Executive Summary

Marc Allen SULFRIDGE of Boise ID (US) is an inventor who has filed 4 patents. Their primary areas of innovation include {Microlenses} (3 patents), {Process for coatings or optical elements} (2 patents), characterised by potential barriers, e.g. phototransistors (2 patents), and they have worked with companies such as SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (4 patents). Their most frequent collaborators include (2 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L27/14627 ({Microlenses}): 3 patents
• H01L27/14685 ({Process for coatings or optical elements}): 2 patents
• H01L31/107 (characterised by potential barriers, e.g. phototransistors): 2 patents
• H04N25/50 (Control of the SSIS exposure): 1 patents
• H04N25/702 (SSIS architectures characterised by non-identical, non-equidistant or non-planar pixel layout): 1 patents
• H04N25/75 (Circuitry for providing, modifying or processing image signals from the pixel array): 1 patents
• H01L27/14634 ({Assemblies, i.e. Hybrid structures}): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/06 ({of a plurality of bonding areas}): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/96 ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 1 patents
• H01L27/14636 ({Interconnect structures}): 1 patents
• H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/06181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/13025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80357 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/96 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/05442 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L31/02027 ({for devices working in avalanche mode}): 1 patents
• H01L27/14605 ({Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery}): 1 patents
• H01L31/055 (where light is absorbed and re-emitted at a different wavelength by the optical element directly associated or integrated with the PV cell, e.g. by using luminescent material, fluorescent concentrators or up-conversion arrangements): 1 patents
• H01L27/14643 ({Photodiode arrays; MOS imagers}): 1 patents
• H01L27/14621 ({Colour filter arrangements}): 1 patents
• H01L27/14629 ({Reflectors}): 1 patents
• H01L27/14649 ({Infrared imagers}): 1 patents
• H01L31/02327 (Optical elements or arrangements associated with the device (): 1 patents
• G02B3/06 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
• H01L27/1463 ({Pixel isolation structures}): 1 patents
• H01L27/1464 ({Back illuminated imager structures}): 1 patents
• H04N25/63 (applied to dark current): 1 patents
• H01L27/14623 ({Optical shielding}): 1 patents
• H01L27/14645 ({Colour imagers}): 1 patents

Companies

List of Companies

• SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC: 4 patents

Collaborators

• Swarnal BORTHAKUR of Boise ID (US) (2 collaborations)
• Byounghee LEE of Boise ID (US) (1 collaborations)
• Ulrich BOETTIGER of GARDEN CITY ID (US) (1 collaborations)
• Mario M. PELELLA of Mountain View CA (US) (1 collaborations)
• Chandrasekharan KOTHANDARAMAN of New York NY (US) (1 collaborations)
• Yusheng LIN of Phoenix AZ (US) (1 collaborations)
• Larry Duane KINSMAN of Redding CA (US) (1 collaborations)
• Anne DEIGNAN (1 collaborations)
• Nader JEDIDI (1 collaborations)
• Michael Gerard KEYES (1 collaborations)
• William CROFOOT of Nampa ID (US) (1 collaborations)