Category:Kuo-Cheng CHIANG

Kuo-Cheng CHIANG

Executive Summary

Kuo-Cheng CHIANG is an inventor who has filed 9 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (6 patents), TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (3 patents). Their most frequent collaborators include (7 collaborations), (3 collaborations), (3 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L29/66439 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L29/775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L29/66545 ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 4 patents
• H01L29/78696 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L21/823481 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
• H01L27/088 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/41733 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H10D84/038 (No explanation available): 2 patents
• H01L21/823437 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/28518 (from a gas or vapour, e.g. condensation): 1 patents
• H01L29/45 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/78651 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/42384 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/785 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2029/7858 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
• H01L21/76897 ({Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step (self-aligned silicidation on field effect transistors): 1 patents
• H01L29/401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01Q21/0043 ({Slotted waveguides (combination with horns): 1 patents
• H01P3/16 (Dielectric waveguides, i.e. without a longitudinal conductor): 1 patents
• H01Q1/3233 ({particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems}): 1 patents
• H01Q13/0233 ({Horns fed by a slotted waveguide array (biconical horns): 1 patents
• H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H10D84/0147 (No explanation available): 1 patents
• H10D84/0149 (No explanation available): 1 patents
• H10D84/834 (No explanation available): 1 patents
• H01L21/76843 ({formed in openings in a dielectric}): 1 patents
• H01L21/76871 ({Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers}): 1 patents
• H01L21/823412 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823418 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823468 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823475 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L29/0847 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/6656 ({using self aligned silicidation, i.e. salicide (formation of conductive layers comprising silicides): 1 patents
• H01L21/823807 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L27/092 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10D30/6735 (No explanation available): 1 patents
• H10D30/014 (No explanation available): 1 patents
• H10D30/43 (No explanation available): 1 patents
• H10D30/6757 (No explanation available): 1 patents
• H10D62/121 (No explanation available): 1 patents
• H10D64/017 (No explanation available): 1 patents
• H10D84/0167 (No explanation available): 1 patents
• H10D84/85 (No explanation available): 1 patents

Companies

List of Companies

• Taiwan Semiconductor Manufacturing Company, Ltd.: 6 patents
• TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.: 3 patents

Collaborators

• Chih-Hao WANG (7 collaborations)
• Chia-Hao CHANG (3 collaborations)
• Kuan-Ting PAN (3 collaborations)
• Jia-Chuan YOU (3 collaborations)
• Huan-Chieh SU (3 collaborations)
• Chun-Yuan CHEN (2 collaborations)
• Chu-Yuan HSU (2 collaborations)
• Szu-Chien WU (1 collaborations)
• Shi-Ning JU (1 collaborations)
• Chih-Hao Wang (1 collaborations)
• Kuan-Ting Pan (1 collaborations)
• Shang-Wen CHANG (1 collaborations)
• Ching-Wei TSAI (1 collaborations)
• Kuan-Lun CHENG (1 collaborations)
• I-Han HUANG (1 collaborations)
• Chung-Wei HSU (1 collaborations)
• Lung-Kun CHU (1 collaborations)
• Jia-Ni YU (1 collaborations)
• Chun-Fu LU (1 collaborations)
• Shih-Hao LAI (1 collaborations)