Category:Kuan-Lun Cheng

Kuan-Lun Cheng

Executive Summary

Kuan-Lun Cheng is an inventor who has filed 11 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (7 patents), {using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate} (6 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (11 patents). Their most frequent collaborators include (5 collaborations), (4 collaborations), (3 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
• H01L29/66545 ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 6 patents
• H01L29/78696 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L21/823431 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 5 patents
• H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L27/0886 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L29/66795 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L21/823418 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 3 patents
• H01L21/823481 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 3 patents
• H01L29/78618 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L29/7851 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/0847 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/0653 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/02532 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/02603 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 2 patents
• H01L29/45 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/66553 ({using self aligned silicidation, i.e. salicide (formation of conductive layers comprising silicides): 2 patents
• H01L29/66742 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/823828 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
• H01L21/31116 ({by dry-etching}): 1 patents
• H01L29/518 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/823412 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823475 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
• H01L29/1037 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/6681 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/161 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/165 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/41733 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02576 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02579 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/30604 (Chemical or electrical treatment, e.g. electrolytic etching (to form insulating layers): 1 patents
• H01L21/31111 ({by chemical means}): 1 patents
• H01L21/76897 ({Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step (self-aligned silicidation on field effect transistors): 1 patents
• H01L29/66636 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/41791 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/823437 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L29/516 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/0206 ({during, before or after processing of insulating layers}): 1 patents
• H01L21/823857 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L27/092 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/42364 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/513 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/517 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/6684 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/78391 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66484 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/7831 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/7848 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/7855 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/1033 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66439 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66818 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/045 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2029/7858 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/0922 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/823807 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823814 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L29/0649 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/78651 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/78684 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/0262 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/6653 ({using self aligned silicidation, i.e. salicide (formation of conductive layers comprising silicides): 1 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/13091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

List of Companies

• Taiwan Semiconductor Manufacturing Co., Ltd.: 11 patents

Collaborators

• Chih-Hao Wang (5 collaborations)
• Ching-Wei Tsai (4 collaborations)
• Kuo-Cheng Chiang (3 collaborations)
• Cheng-Ting Chung (2 collaborations)
• Hou-Yu Chen (2 collaborations)
• Che-Yu Yang (1 collaborations)
• Kai-Chieh Yang (1 collaborations)
• Kuo-Cheng CHING (1 collaborations)
• Lung-Kun Chu (1 collaborations)
• Mao-Lin Huang (1 collaborations)
• Chung-Wei Hsu (1 collaborations)
• Jia-Ni Yu (1 collaborations)
• Jia-Chuan You (1 collaborations)
• Chia-Hao Chang (1 collaborations)
• Min Cao (1 collaborations)
• Pei-Yu Wang (1 collaborations)
• Sai-Hooi Yeong (1 collaborations)
• Chih-Ching Wang (1 collaborations)
• Jon-Hsu Ho (1 collaborations)
• Wen-Hsing Hsieh (1 collaborations)
• Chung-Wei Wu (1 collaborations)
• Zhiqiang Wu (1 collaborations)
• Tetsu Ohtou (1 collaborations)
• Jiun-Jia Huang (1 collaborations)
• Chi-Hsing Hsu (1 collaborations)
• Shi Ning Ju (1 collaborations)
• Guan-Lin Chen (1 collaborations)
• Chi-Yi Chuang (1 collaborations)