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Category:Kengo Aoya of Beppu (JP)

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Kengo Aoya

Kengo Aoya from Beppu (JP) has applied for patents in technology areas such as H01L23/538, H01L21/48, H01L21/56 with texas instruments incorporated.

Patents

FRAME DESIGN IN EMBEDDED DIE PACKAGE (20250087591)

Pages in category "Kengo Aoya of Beppu (JP)"

The following 3 pages are in this category, out of 3 total.

1

18595905. SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS simplified abstract (Texas Instruments Incorporated)
18960733. FRAME DESIGN IN EMBEDDED DIE PACKAGE (TEXAS INSTRUMENTS INCORPORATED)

T

Texas instruments incorporated (20250087591). FRAME DESIGN IN EMBEDDED DIE PACKAGE

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