Category:Kao-Tsair TSAI

Kao-Tsair TSAI

Executive Summary

Kao-Tsair TSAI is an inventor who has filed 3 patents. Their primary areas of innovation include PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices (2 patents), PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices (2 patents), {for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions (2 patents), and they have worked with companies such as Winbond Electronics Corp. (2 patents), WINBOND ELECTRONICS CORP. (1 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• G03F7/70633 (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices): 2 patents
• G03F7/70683 (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices): 2 patents
• H01L22/12 ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions): 2 patents
• H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 2 patents
• H01L2223/54426 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H10B41/42 (ELECTRONIC MEMORY DEVICES): 1 patents
• H10B43/40 (ELECTRONIC MEMORY DEVICES): 1 patents

Companies

List of Companies

• Winbond Electronics Corp.: 2 patents
• WINBOND ELECTRONICS CORP.: 1 patents

Collaborators

• Cheng-Shuai LI (3 collaborations)
• Meng-Hsien TSAI (2 collaborations)
• Yueh-Feng LU (2 collaborations)
• Hsin-Hung CHOU (1 collaborations)